Wheat flour for frying batter

US9743677B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9743677-B2
Application numberUS-201415025393-A
CountryUS
Kind codeB2
Filing dateFeb 26, 2014
Priority dateOct 18, 2013
Publication dateAug 29, 2017
Grant dateAug 29, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A wheat flour for deep-fried food crusts is obtained by subjecting a mixture including a wheat flour and from 0.05 to 0.5 parts by mass of an emulsifier with respect to 100 parts by mass of the wheat flour to a heating treatment for 1 to 20 seconds under a condition where the temperature of the mixture is from 65 to 99° C. The emulsifier is at least one type of emulsifier selected from sucrose fatty acid esters and lecithin. The blending ratio of the emulsifier is preferably from 0.1 to 0.45 parts by mass with respect to 100 parts by mass of the wheat flour. The wheat flour has an average grain size of preferably less than 100 μm. A crust material for deep-fried foods including the aforementioned wheat flour for deep-fried food crusts, and a tempura flour including the aforementioned wheat flour for deep-fried food crusts are also described.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for producing a wheat flour for deep-fried food crusts, the method comprising: subjecting a mixture including a wheat flour and from 0.05 to 0.5 parts by mass of an emulsifier with respect to 100 parts by mass of the wheat flour to a heating treatment for 1 to 20 seconds under a condition where the temperature of the mixture is from 65 to 99° C., wherein the emulsifier is at least one type of emulsifier selected from sucrose fatty acid esters and lecithin, the heating treatment comprising directly applying superheated water vapor or saturated water vapor to the mixture to heat treat the mixture. 2. The method for producing wheat flour for deep-fried food crusts according to claim 1 , wherein the wheat flour for deep-fried food crusts has an average grain size of less than 100 μm. 3. The method for producing wheat flour for deep-fried food crusts according to claim 2 , further comprising making a crust material for deep-fried foods from the wheat flour. 4. The method for producing wheat flour for deep-fried food crusts according to claim 2 , further comprising making a tempura flour from the wheat flour. 5. The method for producing wheat flour for deep-fried food crusts according to claim 1 , further comprising making a crust material for deep-fried foods from the wheat flour. 6. The method for producing wheat flour for deep-fried food crusts according to claim 1 , further comprising making a tempura flour from the wheat flour.

Assignees

Inventors

Classifications

  • Farinaceous granules for dressing meat, fish or the like · CPC title

  • containing emulsifiers · CPC title

  • A21D2/16Primary

    Fatty acid esters · CPC title

  • A23P20/12Primary

    Apparatus or processes for applying powders or particles to foodstuffs, e.g. for breading; Such apparatus combined with means for pre-moistening or battering · CPC title

  • Food compositions, function of food ingredients or processes for food or foodstuffs · CPC title

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What does patent US9743677B2 cover?
A wheat flour for deep-fried food crusts is obtained by subjecting a mixture including a wheat flour and from 0.05 to 0.5 parts by mass of an emulsifier with respect to 100 parts by mass of the wheat flour to a heating treatment for 1 to 20 seconds under a condition where the temperature of the mixture is from 65 to 99° C. The emulsifier is at least one type of emulsifier selected from sucrose …
Who is the assignee on this patent?
Nisshin Foods Inc
What technology area does this patent fall under?
Primary CPC classification A21D2/16. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Aug 29 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).