Methods for directly bonding silicon to silicon or silicon carbide to silicon carbide

Patent metadata

Field	Value
Publication number	US-9741685-B2
Application number	US-201615207933-A
Country	US
Kind code	B2
Filing date	Jul 12, 2016
Priority date	Aug 7, 2015
Publication date	Aug 22, 2017
Grant date	Aug 22, 2017

Abstract

A method for bonding a first silicon part to a second silicon part includes arranging the first silicon part and the second silicon part in direct physical contact on a surface in a thermal insulating structure; controlling pressure in the thermal insulating structure to a predetermined pressure; controlling temperature in the thermal insulating structure to a predetermined temperature using one or more heaters; and bonding the first silicon part and the second silicon part during a process period. The predetermined temperature is in a temperature range that is greater than or equal to 1335° C. and less than 1414° C.

First claim

What is claimed is:

1. A method for bonding a first silicon part to a second silicon part, comprising:
arranging the first silicon part and the second silicon part in direct physical contact on a surface in a thermal insulating structure;
controlling pressure in the thermal insulating structure to a predetermined pressure;
controlling temperature in the thermal insulating structure to a predetermined temperature using one or more heaters; and
bonding the first silicon part and the second silicon part during a process period, the bonding including melting outer surfaces of the first and second silicon parts and allowing capillary forces to draw molten silicon from the outer surfaces of the first and second silicon parts into a gap between the first and second silicon parts,
wherein the predetermined temperature is in a temperature range that is greater than or equal to 1335° C. and less than 1414° C.

2. The method of claim 1 , wherein the pressure in the thermal insulating structure is less than 1 Torr.

3. The method of claim 1 , wherein the process period is between 10 hours and 50 hours.

4. The method of claim 1 , further comprising supplying an inert gas to the thermal insulating structure during the bonding at a pressure less than one atmospheric pressure.

5. The method of claim 1 , wherein a bond that is formed between the first silicon part and the second silicon part is capable of withstanding a working temperature during usage that is greater than 580° C.

6. The method of claim 1 , wherein a bond that is formed between the first silicon part and the second silicon part is capable of withstanding working temperatures during usage that are greater than 580° C. and less than 1335° C.

7. The method of claim 1 , further comprising supplying an external force to hold the first silicon part to the second silicon part during the bonding.

8. The method of claim 7 , wherein the external force is supplied by one of a press and a weight.

9. The method of claim 8 , further comprising arranging a carbon material between one of the press and the weight and at least one of the first silicon part and the second silicon part.

10. The method of claim 1 , wherein a bond that is formed between the first silicon part and the second silicon part has a thermal conductivity of 1.17+/−0.09 W/cm-K.

11. The method of claim 1 , wherein a bond that is formed between the first silicon part and the second silicon part has a tensile strength is greater than 2000 PSI.

12. The method of claim 1 , further comprising arranging a carbon material between a weight or a press and at least one of the first silicon part and the second silicon part.

13. The method of claim 12 , wherein the carbon material is selected from a group consisting of graphite and grafoil.

14. The method of claim 1 , wherein the first silicon part and the second silicon part are bonded together without using an intervening bonding material.

15. The method of claim 1 , wherein a bond that is formed between the first silicon part and the second silicon part is a silicon-silicon covalent bond.

16. The method of claim 1 , wherein the first silicon part and the second silicon part are made of single crystalline silicon.

17. The method of claim 1 , wherein the first silicon part and the second silicon part are made of multi-crystalline silicon.

18. The method of claim 1 , wherein the first silicon part and the second silicon part are arranged on a susceptor in the thermal insulating structure.

19. The method of claim 16 , wherein the susceptor includes a bottom surface and side walls and wherein the heater is arranged between the side walls and the thermal insulating structure.

20. The method of claim 1 wherein the bonding results in formation of a bond between the first and second silicon parts that:
does not have weak van der Waals forces, hydrogen bonds, anodic bonds, or adhesive force; and
does not involve oxygen, hydrogen, or metal as a bonding agent.

21. A method for bonding a first silicon carbide part to a second silicon carbide part, comprising:
arranging the first silicon carbide part and the second silicon carbide part in direct physical contact in a container;
surrounding the first silicon carbide part and the second silicon carbide part in a silicon carbide and silicon powder matrix;
arranging the container in a thermal insulating structure;
controlling pressure in the thermal insulating structure to a predetermined pressure;
controlling temperature in the thermal insulating structure to a predetermined temperature using one or more heaters; and
bonding the first silicon carbide part and the second silicon carbide part during a process period, wherein the predetermined temperature is in a temperature range that is greater than or equal to 1600° C. and less than 2000° C.

22. The method of claim 21 , wherein the pressure in the thermal insulating structure is less than 1 Torr.

23. The method of claim 21 , wherein the process period is between 10 hours and 50 hours.

24. The method of claim 21 , further comprising supplying an inert gas to the thermal insulating structure during the bonding at a pressure less than one atmospheric pressure.

25. The method of claim 21 , wherein a bond that is formed between the first silicon carbide part and the second silicon carbide part is capable of withstanding working temperatures during usage that are greater than 580° C. and less than 1600° C.

26. The method of claim 21 , wherein the first silicon carbide part and the second silicon carbide part are bonded together without using an intervening bonding material.

27. The method of claim 21 , wherein a bond that is formed between the first silicon carbide part and the second silicon carbide part is a Si—C covalent bond.

Assignees

• Lam Res Corp

Inventors

• Chen Jihong
• Wei Jiuan

Classifications

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0434

  mainly by convection · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/07331

  Connecting techniques · CPC title