Plating apparatus, plating method and storage medium having plating program stored thereon

Patent metadata

Field	Value
Publication number	US-9731322-B2
Application number	US-201113881431-A
Country	US
Kind code	B2
Filing date	Aug 24, 2011
Priority date	Oct 27, 2010
Publication date	Aug 15, 2017
Grant date	Aug 15, 2017

Abstract

A plating apparatus 1 can perform plating processes by supplying plating liquids onto a surface of a substrate 2 . The plating apparatus 1 includes a substrate rotating holder configured to hold and rotate the substrate 2 ; plating liquid supply units 29 and 30 configured to supply different kinds of plating liquids onto the surface of the substrate 2 ; a plating liquid drain unit 31 configured to drain out the plating liquids dispersed from the substrate 2 depending on the kinds of the plating liquids; and a controller 32 configured to control the substrate rotating holder 25 , the plating liquid supply units 29 and 30 , the plating liquid drain unit 31 . While the substrate 2 is held and rotated, the plating processes are performed on the surface of the substrate 2 in sequence by supplying the different kinds of the plating liquids onto the surface of the substrate 2.

First claim

What is claimed is:

1. A plating method of performing plating processes by supplying plating liquids onto a surface of a substrate by using a plating apparatus,
wherein the plating apparatus comprises:
a substrate rotating holder configured to hold and rotate the substrate;
a plurality of plating liquid supply units configured to supply different kinds of plating liquids onto the surface of the substrate held by the substrate rotating holder; and
a plating liquid drain unit disposed in a vicinity of the substrate rotating holder and configured to separate the plating liquids dispersed from the substrate depending on the kinds of the plating liquids and drain out the separated plating liquids through drain openings of a cup included in the plating liquid drain unit, and
wherein the plating method comprises:
performing a first plating process on the surface of the substrate by supplying a first plating liquid onto the surface of the substrate from one of the plating liquid supply units;
after performing the first plating process, collecting the first plating liquid which has been used through a first drain opening of the cup;
performing a second plating process on the surface of the substrate by supplying, from another one of the plating liquid supply units, a second plating liquid different from the first plating liquid supplied from the one plating liquid supply unit; and
after performing the second plating process, collecting the second plating liquid which has been used through a second drain opening of the cup by vertically moving the cup, and
wherein the substrate is continuously rotated during performing the first plating process and the second plating process.

Assignees

• Tanaka Takashi
• Saito Yusuke
• Iwashita Mitsuaki
• Toshima Takayuki
• Tokyo Electron Ltd

Inventors

• Tanaka Takashi
• Saito Yusuke
• Iwashita Mitsuaki
• Toshima Takayuki

Classifications

• C23C18/1651

  Two or more layers only obtained by electroless plating · CPC title

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C23C18/54

  Contact plating, i.e. electroless electrochemical plating · CPC title

• B05B12/14 Primary

  for supplying a selected one of a plurality of liquids or other fluent materials {or several in selected proportions} to a {spray apparatus, e.g. to a} single spray outlet · CPC title

• C23C18/31

  Coating with metals · CPC title