Electrically conductive film
US-12177967-B2 · Dec 24, 2024 · US
by using a moving tool for milling or cutting the conductive material
by using a moving tool for milling or cutting the conductive material · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/043 |
| Official title | {by using a moving tool for milling or cutting the conductive material} |
| Display label | by using a moving tool for milling or cutting the conductive material |
| Total patents | 68 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 3 |
| 2016 | 6 |
| 2017 | 5 |
| 2018 | 2 |
| 2019 | 3 |
| 2020 | 7 |
| 2021 | 14 |
| 2022 | 8 |
| 2023 | 9 |
| 2024 | 4 |
| 2025 | 6 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Wiring board, manufacturing method thereof, and battery pack provided with wiring board
US-2024405345-A1 · Dec 5, 2024 · US
Reconfigurable circuit devices
US-11924966-B1 · Mar 5, 2024 · US
Milling of flex foil with two conductive layers from both sides
US-11849544-B2 · Dec 19, 2023 · US
Substrate for mounting a light-emitting element and circuit board for mounting a light-emitting element that includes it, and light-emitting element module
US-11769864-B2 · Sep 26, 2023 · US
Electrically conductive film
US-11751327-B2 · Sep 5, 2023 · US
Electroplating edge connector pins of printed circuit boards without using tie bars
US-2023276578-A1 · Aug 31, 2023 · US
Dual conductor laminated substrate
US-11744023-B2 · Aug 29, 2023 · US
Circuit board
US-2023254970-A1 · Aug 10, 2023 · US
Electroplating edge connector pins of printed circuit boards without using tie bars
US-11653455-B2 · May 16, 2023 · US
Method of manufacturing a double-sided laminate including dry milling a conductive trace pattern and providing a cover layer with precut access holes that expose the trace pattern
US-11617270-B2 · Mar 28, 2023 · US
Prelaminate for an electronic card, and methods for producing such a prelaminate and an electronic card comprising such a prelaminate
US-11599764-B2 · Mar 7, 2023 · US
Method of manufacturing electronic component
US-2022386467-A1 · Dec 1, 2022 · US
Metal Substrate Structure for a Semiconductor Power Module
US-2022344456-A1 · Oct 27, 2022 · US
Electrically conductive film
US-2022287173-A1 · Sep 8, 2022 · US
Electroplating edge connector pins of printed circuit boards without using tie bars
US-2022279659-A1 · Sep 1, 2022 · US
Methods Of Manufacturing Flex Circuits With Mechanically Formed Conductive Traces
US-2022232706-A1 · Jul 21, 2022 · US
Electrically conductive film
US-11388814-B2 · Jul 12, 2022 · US
Milling of flex foil with two conductive layers from both sides
US-2022192028-A1 · Jun 16, 2022 · US
Methods of manufacturing flex circuits with mechanically formed conductive traces
US-11297718-B2 · Apr 5, 2022 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/043?
- CPC H05K3/043 is the Cooperative Patent Classification code for “by using a moving tool for milling or cutting the conductive material.”
- How many patents are filed under CPC H05K3/043 (by using a moving tool for milling or cutting the conductive material)?
- Our database includes 68 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/043 growing?
- Publication counts under this code: 4 in 2024 vs 6 in 2025 (latest complete years).