End effector for transferring a substrate

Patent metadata

Field	Value
Publication number	US-9721820-B2
Application number	US-201414336650-A
Country	US
Kind code	B2
Filing date	Jul 21, 2014
Priority date	Jul 22, 2013
Publication date	Aug 1, 2017
Grant date	Aug 1, 2017

Abstract

Embodiments of the present invention provide an end effector capable of generating an electrostatic chucking force to chuck a substrate disposed therein without damaging the substrate. In one embodiment, an end effector for a robot, the end effector includes a body having an electrostatic chucking force generating assembly, and a mounting end coupled to the body, the mounting end for coupling the body to the robot.

First claim

What is claimed is:

1. An end effector for a robot, the end effector comprising:
a body having an electrostatic chucking force generating assembly, wherein the body comprises an electrode assembly having interleaving electrode formed therein and each electrode includes interconnections formed between electrode islands, wherein the interconnections and the electrode islands in combination form the electrode fingers in a longitudinal form, each electrode finger is spaced apart from each other, defining a space therebetween; and
a mounting end coupled to the body, the mounting end for coupling the body to the robot.

2. The end effector of claim 1 , wherein the electrostatic chucking force generating assembly further comprises:
an insulating base; and
an encapsulating member having a first surface disposed on the electrode assembly, wherein the encapsulating member is fabricated from a ceramic material or glass.

3. The end effector of claim 2 , wherein the ceramic material used to fabricate the encapsulating member is selected from a group consisting of silicon carbide, aluminum nitride, aluminum oxide, yttrium containing materials, yttrium oxide (Y 2 O 3 ), yttrium-aluminum-garnet (YAG), titanium oxide (TiO), or titanium nitride (TiN).

4. The end effector of claim 2 , wherein the insulating base is one of glass or ceramic.

5. The end effector of claim 1 , wherein the electrodes further comprises:
a first electrode interleaved or dispersed among a second electrode.

6. The end effector of claim 1 , wherein the body comprises:
two fingers each including a portion of the electrode assembly disposed in the body, wherein the fingers each has the interconnection formed between the electrode islands.

7. The end effector of claim 1 , wherein the body is a ring.

8. The end effector of claim 6 , wherein the finger is configured to contact an edge of a substrate positioned thereon.

9. The end effector of claim 2 , wherein the electrode assembly includes a first electrode and a second electrode, each first and the second electrode having a plurality of interleaving electrode fingers having the interconnections formed between the electrode islands.

10. The end effector of claim 8 , wherein the end effector is configured to contact the substrate from the edge of a substrate front surface.

11. A method for holding a substrate on an end effector, comprising:
receiving a substrate on an end effector in a processing system; and
generating an electrostatic chucking force from the end effector to chuck the substrate on the end effector, wherein the end effector comprises an electrode assembly formed therein and each electrode includes interconnections formed between electrode islands, wherein the interconnections and the electrode islands in combination form the electrode fingers in a longitudinal form, each electrode finger is spaced apart from each other, defining a space therebetween.

12. The method of claim 11 , wherein the electrode assembly comprises interleaving electrodes.

13. The method of claim 11 , wherein generating the electrostatic chucking force further comprising:
applying an AC or DC power to the electrode assembly disposed in the end effector to generate the electrostatic chucking force.

14. The method of claim 11 , wherein generating the electrostatic chucking force further comprising:
applying a power to the electrode assembly disposed in the end effector; and
generating charges with different polarities from the electrode assembly.

15. The method of claim 11 , wherein the electrode assembly includes an encapsulating member having a first surface disposed on an electrode assembly that includes a plurality of interleaving electrode fingers.

16. The method of claim 15 , wherein the encapsulating member has a ceramic or glass surface configured to contact with the substrate.

17. The method of claim 11 , wherein receiving the substrate on the end effector further comprises:
receiving the substrate from a front surface of the substrate where transistor or devices are formed on.

18. A processing system, comprising:
a processing system;
an end effector disposed in the processing system;
an electrostatic chucking force generating assembly disposed in the end effector, wherein the electrostatic chucking force generating assembly includes a plurality of interleaving electrode fingers forming an electrode assembly and each electrode finger includes interconnections formed between electrode islands, wherein the interconnections and the electrode islands in combination form the electrode fingers in a longitudinal form, each electrode finger is spaced apart from each other, defining a space therebetween; and
an encapsulating member having a first surface disposed on the electrode assembly and a second surface configured to be in contact with a substrate positioned thereon.

19. The processing system of claim 18 , wherein the encapsulating member is a ceramic or a glass material.

Assignees

• Applied Materials Inc

Inventors

• Cox Michael S
• Rosa Michel Anthony

Classifications

• H10P72/3302

  Mechanical parts of transfer devices · CPC title

• H10P72/72 Primary

  using electrostatic chucks · CPC title

• H01L21/67742

  Electricity · mapped topic

• H01L21/6831 Primary

  Electricity · mapped topic