Electrical Testing for Panel Characterization and Defect Screening
US-2024402237-A1 · Dec 5, 2024 · US
US9704762B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9704762-B2 |
| Application number | US-201514610441-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 30, 2015 |
| Priority date | Feb 4, 2014 |
| Publication date | Jul 11, 2017 |
| Grant date | Jul 11, 2017 |
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Official abstract text for this publication.
Methods and apparatus for determining substrate integrity and alignment are described. Devices as described herein can include a transfer chamber, one or more process chambers, a loadlock chamber a first optical device, a second optical device and a radiation source positioned outside and above an opening for the loadlock chamber. Methods as described herein can include delivering a substrate to an opening in a process chamber, activating the optical device and the radiation source and capturing a plurality of images, extracting a substrate edge pattern from the plurality of images, comparing the substrate edge pattern to an expected edge pattern to determine a level of edge variance and adjusting or stopping a process if the level of edge variance is outside of an edge variation range.
Opening claim text (preview).
The invention claimed is: 1. A processing device comprising: a transfer chamber; one or more process chambers in connection with the transfer chamber, the process chambers each comprising a processing entrance proximate the transfer chamber; a loadlock chamber comprising a loadlock entrance and a loadlock exit, the loadlock entrance having an upper wall, a lower wall, a first sidewall and a second sidewall; a first optical device and a second optical device positioned in a factory interface outside of and above the upper wall of the loadlock entrance, the first optical device positioned to view a first lateral edge of a substrate and the second optical device positioned to view a second lateral edge of the substrate; and a radiation source positioned in the factory interface between the first optical device and the second optical device and outside of and above the upper wall of the loadlock entrance, the radiation source positioned to deliver radiation at the first lateral edge and the second lateral edge. 2. The processing device of claim 1 , wherein the first optical device and the second optical device comprise a camera. 3. The processing device of claim 1 , wherein a first optical axis of the first optical device and a second optical axis of the second optical device are positioned perpendicular to the upper wall. 4. The processing device of claim 1 , further comprising a plurality of first optical devices and a plurality of second optical devices. 5. The processing device of claim 1 , wherein at least one of the process chambers is a CVD process chamber.
comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title
Monitoring of warpages, curvatures, damages, defects or the like · CPC title
Position monitoring, e.g. misposition detection or presence detection · CPC title
characterised by the construction of the load-lock chamber · CPC title
Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title
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