Prepreg and carbon fiber reinforced composite material

Patent metadata

Field	Value
Publication number	US-9683326-B2
Application number	US-201314416234-A
Country	US
Kind code	B2
Filing date	Jul 16, 2013
Priority date	Jul 25, 2012
Publication date	Jun 20, 2017
Grant date	Jun 20, 2017

Abstract

A prepreg is formed by impregnating sizing agent-coated carbon fibers coated with a sizing agent with a thermosetting resin composition. The sizing agent contains an aliphatic epoxy compound (A) and an aromatic compound (B) at least containing an aromatic epoxy compound (B1). The sizing agent-coated carbon fibers has an (a)/(b) ratio of 0.50 to 0.90 where (a) is a height (cps) of a component at a binding energy (284.6 eV) assigned to CHx, C—C, and C═C and (b) is a height (cps) of a component at a binding energy (286.1 eV) assigned to C—O in a C 1s core spectrum of a surface of the sizing agent applied onto the carbon fibers analyzed by X-ray photoelectron spectroscopy using AlKα 1,2 as an X-ray source at a photoelectron takeoff angle of 15°.

First claim

The invention claimed is:

1. A prepreg formed by impregnating sizing agent-coated carbon fibers coated with a sizing agent with a thermosetting resin composition, wherein
the sizing agent contains an aliphatic epoxy compound (A) and an aromatic compound (B) at least containing an aromatic epoxy compound (B1),
the sizing agent-coated carbon fibers have an (a)/(b) ratio of 0.50 to 0.90 where (a) is a height (cps) of a component at a binding energy (284.6 eV) assigned to CHx, C—C, and C═C and (b) is a height (cps) of a component at a binding energy (286.1 eV) assigned to C—O in a C 1s core spectrum of a surface of the sizing agent applied onto the carbon fibers analyzed by X-ray photoelectron spectroscopy using Al K α1.2 as an X-ray source at a photoelectron takeoff angle of 15°,
the thermosetting resin composition contains a thermosetting resin (D), a latent curing agent (E), and at least one of the following [1] and [2]:
[1] thermoplastic resin particles or fibers (F) and conductive particles or fibers (G); and
[2] conductive particles or fibers (H) whose thermoplastic resin nucleus or core is covered with a conductive substance,

when containing [1], the thermosetting resin composition contains the thermoplastic resin particles or fibers (F) and the conductive particles or fibers (G) in a mass ratio of 1:1 to 1,000, and the prepreg includes an interlayer formative layer containing (F) and (G) and/or (H) on a surface of a layer formed of the carbon fibers,
wherein the aliphatic epoxy compound (A) is a polyether polyepoxy compound having two or more epoxy groups in a molecule and/or a polyol polyepoxy compound having two or more epoxy groups in a molecule, and
wherein the aliphatic epoxy compound (A) is a glycidyl ether epoxy compound obtained by a reaction of epichlorohydrin with one or more compounds selected from the group consisting of ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, polyethylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol, tetrapropylene glycol, polypropylene glycol, trimethylene glycol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, polybutylene glycol, 1,5-pentanediol, neopentyl glycol, 1,6-hexanediol, 1,4-cyclohexanedimethanol, glycerol, diglycerol, polyglycerol, trimethylolpropane, pentaerythritol, sorbitol, and arabitol.

2. The prepreg according to claim 1 , wherein
the thermosetting resin composition contains [1] and,
the prepreg includes an interlayer formative layer containing (F) and (G) on the surface of the layer formed of the carbon fibers.

3. The prepreg according to claim 2 , wherein an average diameter of a particle diameter or a fiber diameter of the conductive particles or fibers (G) is equal to or larger than a particle diameter or a fiber diameter of the thermoplastic resin particles or fibers (F) and is 150 μm or less.

4. The prepreg according to claim 2 , wherein the conductive particles or fibers (G) are at least one selected from the group consisting of: carbon particles; particles whose inorganic material nucleus is covered with a conductive substance; particles whose organic material nucleus is covered with a conductive substance; carbon fibers; fibers whose inorganic material core is covered with a conductive substance; and fibers whose organic material core is covered with a conductive substance.

5. The prepreg according to claim 1 , wherein
the thermosetting resin composition contains [2], and
the prepreg includes an interlayer formative layer containing (H) on the surface of the layer formed of the carbon fibers.

6. The prepreg according to claim 1 , wherein
an average diameter of the thermoplastic resin particles or fibers (F), the conductive particles or fibers (G), and the conductive particles or fibers (H) whose thermoplastic resin nucleus or core is covered with a conductive substance is 5 to 150 μm, and
the thermosetting resin composition contains second conductive particles (I) having an average diameter of 1 μm or less.

7. The prepreg according to claim 6 , wherein 90 to 100% by mass of the second conductive particles (I) are localized inside carbon fibers positioned closest to both sides in the thickness direction of the prepreg.

8. The prepreg according to claim 1 , wherein 90 to 100% by mass of the thermoplastic resin particles or fibers (F), the conductive particles or fibers (G), and the conductive particles or fibers (H) whose thermoplastic resin nucleus or core is covered with a conductive substance are localized within a depth range of 20% from both sides in a thickness direction of the prepreg.

9. The prepreg according to claim 1 , wherein the total mass of the thermoplastic resin particles or fibers (F), the conductive particles or fibers (G), and the conductive particles or fibers (H) whose thermoplastic resin nucleus or core is covered with a conductive substance is 1 to 20% by mass relative to the prepreg.

10. The prepreg according to claim 1 , wherein the latent curing agent (E) is an aromatic amine curing agent (E1), and the aromatic amine curing agent (E1) contains a diphenyl sulfone skeleton.

11. The prepreg according to claim 10 , wherein the sizing agent and the aromatic amine curing agent (E1) are used in a combination to give an increase in glass transition point of 25° C. or less after the sizing agent and the aromatic amine curing agent (E1) are mixed in an amine equivalent/epoxy equivalent ratio of 0.9 and then are stored in an atmosphere at 25° C. and 60% RH for 20 days.

12. The prepreg according to claim 1 , wherein the epoxy equivalent of the applied sizing agent is 350 to 550 g/eq.

13. The prepreg according to claim 1 , wherein the sizing agent at least contains the aliphatic epoxy compound (A) in an amount of 35 to 65% by mass and the aromatic compound (B) in an amount of 35 to 60% by mass relative to a total amount of the sizing agent except a solvent.

14. The prepreg according to claim 1 , wherein a mass ratio of the aliphatic epoxy compound (A) and the aromatic epoxy compound (B1) is 52/48 to 80/20.

15. The prepreg according to claim 1 , wherein the aromatic epoxy compound (B1) is a bisphenol A epoxy compound or a bisphenol F epoxy compound.

16. The prepreg according to claim 1 , wherein the sizing agent contains an ester compound (C) having no epoxy group in a molecule in an amount of 2 to 35% by mass relative to the total amount of the sizing agent except the solvent.

17. The prepreg according to claim 1 , wherein relation (III) is satisfied with (I) and (II) obtained from (a) and (b):
0.50≦( I )≦0.90 and 0.60<( II )/( I )<1.0  (III)

where (I) is a value of (a)/(b) of surfaces of the sizing agent-coated carbon fibers before ultrasonication, (II) is the value of (a)/(b) of the surfaces of the sizing agent-coated carbon fibers in which an adhesiveness amount of the sizing agent is reduced to 0.09 to 0.20% by mass by ultrasonication on the sizing agent-coated carbon fibers in an acetone solvent, and in a C 1s core spectrum of the sizing agent-coated carbon fibers analyzed by X-ray photoelectron spectroscopy using an X-ray at 400 eV at a photoelectron takeoff angle of 55°, (a) is the height (cps) of a component at a binding energy (284.6 eV) assigned to CHx, C—C, and C═C, and (b) is the height (cps) of a component at a binding energy (286.1 eV) assigned to C—O.

18. A carbon fiber reinforced composite material formed by molding the prepreg according to claim 1 .

Assignees

• Toray Industries

Inventors

• Arai Nobuyuki
• Ichikawa Tomoko
• Taiko Hiroshi
• Endo Makoto
• Kobayashi Masanobu
• Misumi Jun

Classifications

• D06M2101/40

  Fibres of carbon · CPC title

• C08G59/38

  together with di-epoxy compounds · CPC title

• D06M15/55 Primary

  Epoxy resins · CPC title

• Y10T428/254

  Polymeric or resinous material · CPC title

• C08J5/06

  using pretreated fibrous materials · CPC title