Film structure for electric field guided photoresist patterning process
US-11880137-B2 · Jan 23, 2024 · US
US9682400B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9682400-B2 |
| Application number | US-201414522542-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 23, 2014 |
| Priority date | Oct 25, 2013 |
| Publication date | Jun 20, 2017 |
| Grant date | Jun 20, 2017 |
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A mask frame assembly for thin film deposition and manufacturing method thereof are disclosed. One inventive aspect includes a mask frame, a plurality of first masks and a plurality of second masks. The first and second masks are alternately formed in a first direction. Two overlapped portions of each of the first and second masks are connected to both sides of the non-overlapped portion of each of the first and second mask, respectively. In addition, one overlapped portion of each first mask and one overlapped portion of each second mask overlap each other at a connection area.
Opening claim text (preview).
What is claimed is: 1. A mask frame assembly for thin film deposition, comprising: a mask frame; and a plurality of first masks and a plurality of second masks alternately formed in a first direction and connected to each other, configured to selectively pattern a thin film material on a substrate, wherein each first mask includes: a first non-overlapped portion having a first thickness, a first overlapped portion having a second thickness, and a second overlapped portion, the first and second overlapped portions connected to both sides of the first non-overlapped portion, wherein each second mask includes: a second non-overlapped portion, a third overlapped portion, and a fourth overlapped portion having a third thickness, the third and fourth overlapped portions connected to both sides of the second non-overlapped portion, wherein the first overlapped portion of the first mask and the fourth overlapped portion of the second mask overlap with each other at a connection area, and wherein the first thickness is equal to the sum of the second thickness and the third thickness. 2. The assembly of claim 1 , wherein a plurality of first openings is formed at the first overlapped portion, wherein a plurality of second openings is formed at the fourth overlapped portion, and wherein the first openings and the second openings overlap each other at the connection area. 3. The assembly of claim 2 , wherein the width of the connection area measured in the first direction is greater than the width of each of the first openings and the second openings in the first direction. 4. The assembly of claim 1 , wherein the second overlapped portion of the first mask and the third overlapped portion of the second mask overlap with each other at the connection area. 5. The assembly of claim 1 , wherein the connection area extends in a second direction that is vertical to the first direction. 6. The assembly of claim 1 , further comprising: a first edge formed at a first end in the first direction; and a second edge portion formed at a second end facing the first edge in the first direction, wherein the first edge and the second edge include an overlapped portion formed at the first end and the second end, respectively, and wherein the overlapped portions each have the same thickness as each of the first, second, third and fourth overlapped portions. 7. The assembly of claim 1 , wherein the connection area includes: an overlapping area in which the first overlapped portion of the first mask and the fourth overlapped portion of the second mask overlap each other, and a non-overlapping area in which the first overlapped portion of the first mask and the fourth overlapped portion of the second mask do not overlap with each other. 8. The assembly of claim 7 , wherein: the overlapping area and the non-overlapping area of the connection area are placed alternately to each other in the second direction that is vertical to the first direction. 9. The assembly of claim 7 , wherein: a plurality of first openings is formed at the first overlapped portion, a plurality of second openings is formed at the fourth overlapped portion, and the first openings and the second openings overlap with each other at the overlapped portion of the connection area. 10. The assembly of claim 9 , wherein the width of the overlapped portion of the connection area in the first direction is greater than the width of each of the first openings and the second openings measured in the first direction.
of organic photoresist masks · CPC title
using masks · CPC title
Masking devices (stencils B05C17/06; masking devices for which the means for applying liquids or other fluent material is spraying or is not important B05B12/20) · CPC title
Electricity · mapped topic
Assembling or joining · CPC title
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