Double-masking technique for increasing fabrication yield in superconducting electronics
US-10109673-B2 · Oct 23, 2018 · US
US9680081B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9680081-B2 |
| Application number | US-201213677622-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 15, 2012 |
| Priority date | Nov 22, 2011 |
| Publication date | Jun 13, 2017 |
| Grant date | Jun 13, 2017 |
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Problem There is proposed an innovative cross-sectional structure, with an idea contrary to the conventional one, utilizing the non-reactivity between Cu and Ta (or between Ag and Nb, Ta) in a high-temperature short-time heat treatment, thus achieving (1) the suppression of the low magnetic-field instability, (2) excellent wire drawability of a precursor wire, and (3) the reduction of the cost required for the incorporation of a stabilizer. Means for Resolution There is proposed a structure having an assembly of a plurality of single wires, wherein the assembly is covered with an outer cover (skin) formed from Nb or Ta, wherein each of the single wires has an Nb/Al composite filament region which is formed from a composite of Nb and Al mixed in an Nb:Al molar ratio of 3:1, and which is covered with a partition formed from Nb or Ta, and further covered with an interfilamentary barrier formed from Cu or Ag disposed around the partition.
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The invention claimed is: 1. A precursor wire for producing an Nb 3 Al superconducting wire by rapid-heating, quenching and transformation processes, comprising an assembly of a plurality of single wires, the assembly being covered with an outer cover (skin) formed from Nb or Ta, wherein each of the single wires comprises an Nb/Al composite filament region which is formed from a composite of Nb and Al mixed in an Nb:Al molar ratio of 3:1, an interfilamentary barrier formed from Cu or Ag covered on the outside of the Nb/Al composite filament region for effectively electromagnetic decoupling of superconducting filaments, and a partition formed from Nb or Ta provided between the Nb/Al composite filament region and the interfilamentary barrier for preventing the interfilamentary barrier from reacting with the Nb/Al composite filament region to form a non-superconducting compound, wherein the volume fraction of Cu or Ag in the single wire is 7 to 25%, and wherein, when Cu is used as the interfilamentary barrier, Ta film having a thickness of 5 μm or more is used as the partition, and, when Ag is used as the interfilamentary barrier, Nb or Ta film having a thickness of 1 μm or more is used as the partition. 2. The precursor wire for producing Nb 3 Al superconducting wire according to claim 1 , wherein internal stabilizer filaments each formed from Cu or Ag and covered with an internal-stabilizer-filament-covering-layer formed from Nb or Ta are disposed inside the assembly. 3. The precursor wire for producing Nb 3 Al superconducting wire according to claim 1 , wherein dummy filaments each formed from Nb or Ta and covered with a dummy filament covering layer formed from Cu or Ag are disposed inside the assembly. 4. The precursor wire for producing Nb 3 Al superconducting wire according to claim 1 , wherein the assembly comprises Cu, and wherein the assembly is covered with the outer cover (skin) comprising Ta. 5. The precursor wire for producing Nb 3 Al superconducting wire according to claim 1 , wherein the assembly comprises Ag, and wherein the assembly is covered with the outer cover (skin) comprising Nb or Ta. 6. An Nb 3 Al superconducting wire which is obtained from the precursor wire for the Nb 3 Al superconducting wire according to claim 1 , wherein the Nb/Al composite filament regions have been converted to the Nb 3 Al filaments. 7. A method for producing an Nb 3 Al superconducting wire, comprising: subjecting the precursor wire for the Nb 3 Al superconducting wire according to claim 1 to heat treatment at 1,900° C. or higher for 5 seconds or less; quenching the resultant precursor wire to 500° C. or lower; and subjecting the quenched wire to additional heat treatment at 700 to 900° C.
Group VB metal-base component · CPC title
Apparatus or processes specially adapted for manufacturing conductors or cables · CPC title
characterised by their form · CPC title
Electricity · mapped topic
Electricity · mapped topic
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