Lumped-element device for quantum information processing systems

Patent metadata

Field	Value
Publication number	US-9893262-B2
Application number	US-201515110364-A
Country	US
Kind code	B2
Filing date	Jul 6, 2015
Priority date	Jul 6, 2015
Publication date	Feb 13, 2018
Grant date	Feb 13, 2018

Abstract

In some aspects, a quantum information processing circuit includes a lumped-element device on the surface of a dielectric substrate. The lumped-element device can include a capacitor pad and an inductive transmission line. The capacitor pad can be capacitively coupled to another capacitor pad. The inductive transmission line can reside in an interior clearance area defined by an inner boundary of the capacitor pad. The lumped-element device can be, for example, a resonator device or a filter device. The inductive transmission line can be, for example, a meander inductor.

First claim

What is claimed is:

1. A quantum information processing circuit comprising:
a dielectric substrate; and
a lumped-element device on the dielectric substrate, the lumped-element device comprising:
a first capacitor pad on the dielectric substrate, the first capacitor pad being capacitively coupled to a second capacitor pad, the first capacitor pad having an outer boundary and an inner boundary, the inner boundary defining an interior clearance area in the first capacitor pad; and
an inductive transmission line on the dielectric substrate in the interior clearance area in the first capacitor pad;

wherein the lumped-element device comprises a microwave resonator device having a resonance frequency in the range of two hundred (200) MHz to twenty (20) GHz, and the largest spatial dimension of the lumped-element device is less than one-tenth of a guided wavelength at the lowest-mode resonance frequency of the lumped-element device.

2. The quantum information processing circuit of claim 1 , comprising a coplanar waveguide topology, wherein the lumped-element device resides on a first side of the dielectric substrate, and the quantum information processing circuit comprises a ground conductor on the first side of the dielectric substrate.

3. The quantum information processing circuit of claim 1 , comprising a microstrip topology, wherein the lumped-element device resides on a first side of the dielectric substrate, and the quantum information processing circuit comprises a ground conductor on a second, opposite side of the dielectric substrate.

4. The quantum information processing circuit of claim 1 , wherein the second capacitor pad comprises a ground conductor.

5. The quantum information processing circuit of claim 1 , wherein the inductive transmission line comprises a meander inductor in the interior clearance area in the first capacitor pad.

6. The quantum information processing circuit of claim 1 , wherein the lumped-element device comprises a filter device.

7. The quantum information processing circuit of claim 1 , comprising a ground conductor, wherein the inductive transmission line comprises an end conductively coupled to the ground conductor.

8. The quantum information processing circuit of claim 1 , comprising a ground conductor, wherein the inductive transmission line comprises:
a first end coupled to the inner boundary of the first capacitor pad; and
a second end coupled to the ground conductor.

9. The quantum information processing circuit of claim 1 , further comprising a qubit device coupled to the lumped-element device.

10. The quantum information processing circuit of claim 1 , wherein the first capacitor pad and the inductive transmission line comprise superconducting material.

11. The quantum information processing circuit of claim 1 , wherein the dielectric substrate comprises at least one of silicon, sapphire or diamond.

12. The quantum information processing circuit of claim 1 , wherein the lumped-element device comprises a microwave resonator device having a resonance frequency that is defined at least in part by:
a capacitance between the first and second capacitor pads; and
an inductance of the inductive transmission line.

13. The quantum information processing circuit of claim 1 , wherein the inductive transmission line resides in the interior clearance area in the first capacitor pad, and is surrounded by the first capacitor pad.

14. The quantum information processing circuit of claim 1 , wherein the largest spatial dimension of the lumped-element device is less than one-twentieth of a guided wavelength at the lowest-mode resonance frequency of the lumped-element device.

15. A method of forming a lumped-element device in a quantum information processing circuit, the method comprising:
receiving a dielectric substrate;
forming a first capacitor pad on a surface of the dielectric substrate, the first capacitor pad being capacitively coupled to a second capacitor pad, the first capacitor pad having an outer boundary and an inner boundary, the inner boundary defining an interior clearance area in the first capacitor pad;
forming an inductive transmission line on the dielectric substrate in the interior clearance area in the first capacitor pad;
wherein forming the lumped-element device comprises forming a microwave resonator device having a resonance frequency in the range of two hundred (200) MHz to twenty (20) GHz, and the largest spatial dimension of the lumped-element device is less than one-tenth of a guided wavelength at the lowest-mode resonance frequency of the lumped-element device.

16. The method of claim 15 , wherein at least a portion of the first capacitor pad and the inductive transmission line are formed by depositing a single layer of conductor material on the dielectric substrate.

17. The method of claim 15 , comprising defining a size parameter of the inductive transmission line to control a resonance frequency of the microwave resonator device.

18. The method of claim 15 , wherein the first capacitor pad and the inductive transmission line comprise superconducting material.

19. The method of claim 15 , wherein the dielectric substrate comprises at least one of silicon, sapphire or diamond.

20. The method of claim 15 , wherein the lumped-element device comprises a microwave resonator device having a resonance frequency that is defined at least in part by:
a capacitance between the first and second capacitor pads; and
an inductance of the inductive transmission line.

21. The method of claim 15 , comprising defining a size parameter of the first and second capacitor pads to control a resonance frequency of the microwave resonator device.

22. The method of claim 15 , wherein the inductive transmission line is formed such that the inductive transmission line resides in the interior clearance area in the first capacitor pad, and is surrounded by the first capacitor pad.

23. The method of claim 15 , wherein the largest spatial dimension of the lumped-element device is less than one-twentieth of a guided wavelength at the lowest-mode resonance frequency of the lumped-element device.

24. A quantum information processing circuit comprising:
a qubit device; and
a resonator device coupled to the qubit device, the resonator device comprising:
a first capacitor pad on a dielectric substrate, the first capacitor pad being capacitively coupled to a second capacitor pad, the first capacitor pad having an outer boundary and an inner boundary, the inner boundary defining an interior clearance area in the first capacitor pad; and
an inductive transmission line on the dielectric substrate in the interior clearance area in the first capacitor pad;

wherein the resonator device comprises a microwave resonator device having a resonance frequency in the range of two hundred (200) MHz to twenty (20) GHz, and the largest spatial dimension of the resonator device is less than one-tenth of a guided wavelength at the lowest-mode resonance frequency of the resonator device.

25. The quantum information processing circuit of claim 24 , comprising a signal line on the dielectric substrate, the signal line providing communication between the resonator device and the qubit device.

26. The quantum information processing circuit of claim 24 , wherein the inductive transmission line comprises a meander inductor in the interior clearance area in the first capacitor pad.

Assignees

• Rigetti & Co Inc

Inventors

• Thompson Dane Christoffer
• Rigetti Chad Tyler

Classifications

• H03H3/00

  Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators · CPC title

• H01P7/082

  Microstripline resonators (H01P7/088 takes precedence) · CPC title

• H01P11/003

  Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines · CPC title

• H01L39/025 Primary

  Electricity · mapped topic

• H01P3/081

  Microstriplines · CPC title