Semiconductor device and method of forming interconnect substrate for FO-WLCSP
US-9679863-B2 · Jun 13, 2017 · US
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Feng Xia patents
Feng Xia holds 2 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 2 |
| Recent patents | 0 |
| First publication | Dec 1, 2015 |
| Latest publication | Jun 13, 2017 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W90/724 | 2 |
| H10W74/00 | 2 |
| H10W72/01257 | 2 |
| H10W72/01238 | 2 |
| H10W72/01235 | 2 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 2 |