In-situ temperature measurement in a noisy environment

Patent metadata

Field	Value
Publication number	US-9673074-B2
Application number	US-201414189664-A
Country	US
Kind code	B2
Filing date	Feb 25, 2014
Priority date	Mar 15, 2013
Publication date	Jun 6, 2017
Grant date	Jun 6, 2017

Abstract

Disclosed are method and apparatus for treating a substrate. The apparatus is a dual-function process chamber that may perform both a material process and a thermal process on a substrate. The chamber has an annular radiant source disposed between a processing location and a transportation location of the chamber. Lift pins have length sufficient to maintain the substrate at the processing location while the substrate support is lowered below the radiant source plane to afford radiant heating of the substrate. One or more lift pins has a light pipe disposed therein to collect radiation emitted or transmitted by the substrate when the lift pin contacts the substrate surface.

First claim

What is claimed is:

1. A lift pin for supporting a substrate in a semiconductor processing chamber, the lift pin comprising a light pipe and a swivel coupling disposed in an end of the lift pin, wherein the swivel coupling has a contoured substrate contact surface.

2. The lift pin of claim 1 , wherein the substrate contact surface forms a light trap.

3. The lift pin of claim 2 , wherein the light trap comprises a groove in the substrate contact surface.

4. The lift pin of claim 3 , wherein the swivel coupling is disposed between the light pipe and a tip of the lift pin.

5. The lift pin of claim 4 , wherein the swivel coupling protrudes beyond the light pipe and the tip.

6. The lift pin of claim 4 , wherein the swivel coupling is rotatable.

7. The lift pin of claim 2 , wherein the light trap comprises a tortuous surface of the swivel coupling.

8. The lift pin of claim 1 , wherein the swivel coupling comprises a thermally conductive material.

9. The lift pin of claim 8 , wherein the thermally conductive material is a metal.

10. The lift pin of claim 1 , wherein the substrate contact surface is contoured with a groove.

11. The lift pin of claim 10 , wherein the groove reduces parallelism between the substrate contact surface and a surface of the substrate.

12. The lift pin of claim 10 , wherein the groove reduces reflective transmission of light through an interface between the substrate contact surface and a surface of the substrate.

13. The lift pin of claim 1 , wherein the substrate contact surface has a non-parallel portion relative to a surface of the substrate.

14. The lift pin of claim 13 , wherein the non-parallel portion disturbs reflective propagation of light through an interface between the substrate contact surface and the surface of the substrate.

15. The lift pin of claim 13 , wherein the non-parallel portion reduces intrusion of radiation around the swivel coupling and into the light pipe.

Assignees

• Applied Materials Inc

Inventors

• Wu Hanbing
• Subramani Anantha K
• Wang Wei W
• Hunter Aaron Muir

Classifications

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title

• H10P72/0602 Primary

  Temperature monitoring · CPC title

• G01J5/0818

  Waveguides · CPC title

• G01J5/0007

  of wafers or semiconductor substrates, e.g. using Rapid Thermal Processing · CPC title

• H01L21/68742

  Electricity · mapped topic