Trench shielding with photoimageable dielectric (pid) material
US-2025316612-A1 · Oct 9, 2025 · US
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Salmon Jay Scott patents
Salmon Jay Scott is listed as an inventor on 23 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Salmon Jay Scott |
| Total patents | 23 |
| First publication | May 5, 2016 |
| Latest publication | Oct 9, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Antenna module having antenna in mold layer, and related fabrication methods
US-2024396227-A1 · Nov 28, 2024 · US
Package comprising an integrated device with a back side metal layer
US-12100649-B2 · Sep 24, 2024 · US
Multi-component modules (MCMs) including configurable electromagnetic isolation (EMI) shield structures and related methods
US-12100669-B2 · Sep 24, 2024 · US
Package comprising a block device with a shield and method of fabricating the same
US-11985804-B2 · May 14, 2024 · US
MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTROMAGNETIC ISOLATION (EMI) SHIELD STRUCTURES AND RELATED METHODS
US-2024021538-A1 · Jan 18, 2024 · US
Multi-component modules (MCMs) including configurable electro-magnetic isolation (EMI) shield structures, and related methods
US-11721639-B2 · Aug 8, 2023 · US
Package comprising an integrated device with a back side metal layer
US-2023091182-A1 · Mar 23, 2023 · US
Package comprising a substrate with a pad interconnect comprising a protrusion
US-2023070275-A1 · Mar 9, 2023 · US
Package comprising a block device with a shield
US-2023023868-A1 · Jan 26, 2023 · US
Recent patents
Latest publications not already listed above.
MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTRO-MAGNETIC ISOLATION (EMI) SHIELD STRUCTURES, AND RELATED METHODS
US-2021407927-A1 · Dec 30, 2021 · US
Molded lead frame package with embedded die
US-10160637-B2 · Dec 25, 2018 · US
Lead frame-based chip carrier used in the fabrication of MEMS transducer packages
US-10057688-B2 · Aug 21, 2018 · US
Metalized microphone lid with integrated wire bonding shelf
US-10028068-B2 · Jul 17, 2018 · US
Microphone package with molded spacer
US-9894444-B2 · Feb 13, 2018 · US
Microphone package with molded spacer
US-2017303049-A1 · Oct 19, 2017 · US
Metalized microphone lid with integrated wire bonding shelf
US-2017195814-A1 · Jul 6, 2017 · US
Microphone package with molded spacer
US-9661421-B2 · May 23, 2017 · US
Metalized microphone lid with integrated wire bonding shelf
US-9641940-B2 · May 2, 2017 · US
Metalized microphone lid with integratd wire bonding shelf
US-2016212548-A1 · Jul 21, 2016 · US
Molded lead frame package with embedded die
US-2016207759-A1 · Jul 21, 2016 · US
Lead frame-based chip carrier used in the fabrication of mems transducer packages
US-2016134974-A1 · May 12, 2016 · US
Microphone package with molded spacer
US-2016127838-A1 · May 5, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Bosch Gmbh Robert | 12 |
| Qualcomm Inc | 11 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B81B2201/0257 | 12 |
| H04R2201/003 | 12 |
| H04R19/04 | 12 |
| H10W90/753 | 10 |
| H10W42/20 | 9 |