Thin fan, electronic system and manufacturing method of thin fan

US9316230B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9316230-B2
Application numberUS-201414555276-A
CountryUS
Kind codeB2
Filing dateNov 26, 2014
Priority dateMar 31, 2014
Publication dateApr 19, 2016
Grant dateApr 19, 2016

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A manufacturing method of the thin fan includes the steps of: providing a plastic material containing a plurality of metal particles; processing the plastic material to form a housing; removing a part surface of the housing and forming a layout area and an extended circuit on the housing, wherein one terminal of the extended circuit connects to the layout area; disposing a first signal connecting structure on the housing, wherein the first signal connecting structure connects to the other terminal of the extended circuit; and disposing a metal layer on the layout area and the extended circuit.

First claim

Opening claim text (preview).

What is claimed is: 1. A thin fan, comprising: a housing composed of a plastic material containing a plurality of metal particles, the housing comprising: a layout area which is an integral part of the housing, wherein a first part of the metal particles is exposed to the layout area, an extended circuit which is an integral part of the housing, wherein a second part of the metal particles is exposed to the extended circuit, and a first terminal of the extended circuit connects to the layout area, a first signal connecting structure, wherein a terminal of the first signal connecting structure connects to a second terminal of the extended circuit, and a metal layer disposed on the layout area and the extended circuit and binding with the exposed metal particles; a stator disposed in the housing; and an impeller covered by the housing. 2. The thin fan of claim 1 , wherein the housing further has a protrusion portion, and the first signal connecting structure is disposed on the protrusion portion. 3. The thin fan of claim 1 , wherein the housing comprises a cable, and the cable is connected to the first signal connecting structure. 4. The thin fan of claim 1 , wherein the housing further comprises a fixing unit, and the first signal connecting structure is disposed on the fixing unit. 5. The thin fan of claim 1 , wherein the housing comprises a first surface and a second surface opposite to the first surface, the layout area is disposed on the first surface, the first signal connecting structure is disposed on the second surface, and the extended circuit is extended from the first surface to the second surface. 6. An electronic system, comprising: a thin fan comprising: a housing composed of a plastic material containing a plurality of metal particles, the housing comprising: a layout area which is an integral part of the housing, wherein a first part of the metal particles is exposed to the layout area, an extended circuit which is an integral part of the housing, wherein a second part of the metal particles is exposed to the extended circuit, and a first terminal of the extended circuit connects to the layout area, a first signal connecting structure, wherein a terminal of the first signal connecting structure connects to a second terminal of the extended circuit, and a metal layer disposed on the layout area and the extended circuit and binding with the exposed metal particles; a stator disposed in the housing; and an impeller covered by the housing; and an electronic device having a second signal connecting structure connecting with the first signal connecting structure. 7. The electronic system of claim 6 , wherein the housing further has a protrusion portion, and the first signal connecting structure is disposed on the protrusion portion. 8. The electronic system of claim 6 , wherein the housing comprises a cable, a first terminal of the cable is connected to the first signal connecting structure, and a second terminal of the cable is connected to the second signal connecting structure. 9. The electronic system of claim 6 , wherein the housing further comprises a fixing unit, and the first signal connecting structure is disposed on the fixing unit. 10. The electronic system of claim 6 , wherein the housing comprises a first surface and a second surface opposite to the first surface, the layout area is disposed on the first surface, the first signal connecting structure is disposed on the second surface, and the extended circuit is extended from the first surface to the second surface.

Assignees

Inventors

Classifications

  • Axial flow fans · CPC title

  • by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam · CPC title

  • for fans or blowers · CPC title

  • for axial flow fans (blade mountings F04D29/34, blades F04D29/38) · CPC title

  • Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing · CPC title

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Frequently asked questions

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What does patent US9316230B2 cover?
A manufacturing method of the thin fan includes the steps of: providing a plastic material containing a plurality of metal particles; processing the plastic material to form a housing; removing a part surface of the housing and forming a layout area and an extended circuit on the housing, wherein one terminal of the extended circuit connects to the layout area; disposing a first signal connecti…
Who is the assignee on this patent?
Delta Electronics Inc
What technology area does this patent fall under?
Primary CPC classification F04D25/0693. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Apr 19 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).