Methods for bonding substrates

Patent metadata

Field	Value
Publication number	US-9627231-B2
Application number	US-201314015650-A
Country	US
Kind code	B2
Filing date	Aug 30, 2013
Priority date	Sep 19, 2012
Publication date	Apr 18, 2017
Grant date	Apr 18, 2017

Abstract

Methods for bonding substrates, forming assemblies using the same, along with improved methods for refurbishing said assemblies are disclosed that take advantage of at least one channel formed in an adhesive utilized to join two substrates to improve fabrication, performance and refurbishment of the assemblies. In one embodiment an assembly includes a first substrate secured to a second substrate by an adhesive layer. The assembly includes a channel having at least one side bounded by the adhesive layer and having an outlet exposed to an exterior of the assembly.

First claim

What is claimed is:

1. An assembly, comprising:
a first substrate;
a second substrate;
an adhesive layer securing the first and second substrates, wherein the adhesive layer comprises a plurality of segments, and wherein the plurality of segments comprises:
at least two segments fabricated from different adhesive materials; and

a channel having at least one side bounded by the adhesive layer and having an outlet exposed to an exterior of the assembly, the substrates secured by the adhesive layer forming a component for a semiconductor vacuum processing chamber.

2. An assembly, comprising:
a first substrate;
a second substrate;
an adhesive layer securing the first and second substrates, wherein the adhesive layer comprises a plurality of segments, and wherein the plurality of segments comprises:
a first segment comprised of a first adhesive material having a coefficient of thermal conductivity different than a second adhesive material comprising a second segment; and

a channel having at least one side bounded by the adhesive layer and having an outlet exposed to an exterior of the assembly, the substrates secured by the adhesive layer forming a component for a semiconductor vacuum processing chamber.

3. An assembly, comprising:
a first substrate;
a second substrate;
an adhesive layer securing the first and second substrates, wherein the adhesive layer comprises a plurality of segments, and wherein the plurality of segments comprises:
a first segment comprised of a first adhesive material having a strength different than a second adhesive material comprising a second segment; and

a channel having at least one side bounded by the adhesive layer and having an outlet exposed to an exterior of the assembly, the substrates secured by the adhesive layer forming a component for a semiconductor vacuum processing chamber.

Assignees

• Applied Materials Inc

Inventors

• Narendrnath Kadthala Ramaya
• Sheelavant Gangadhar
• Agarwal Monika
• Bhatnagar Ashish

Classifications

• H10P72/7412

  the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/0434

  mainly by convection · CPC title

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/722

  Details of electrostatic chucks · CPC title