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Apparatus and method for bonding substrates
US9613840B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9613840-B2 |
| Application number | US-201114238091-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 22, 2011 |
| Priority date | Aug 12, 2011 |
| Publication date | Apr 4, 2017 |
| Grant date | Apr 4, 2017 |
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- Title
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Abstract
Official abstract text for this publication.
This invention relates to a method and a device for temporary bonding of a first substrate with a second substrate. The device is comprised of a mounting apparatus for mounting of the first substrate on a mounting contour with an active mounting surface. The mounting apparatus has an outer ring section for controllable fixing of the first substrate. Deformation means are provided for controllable deformation of the first substrate. The deformation means act within the outer ring section. Bonding means are provided for bonding of the first substrate with the second substrate.
First claim
Opening claim text (preview).
Having described the invention, the following is claimed: 1. A device for temporary bonding of a first substrate with a second substrate comprising: a mounting apparatus for mounting of the first substrate on a mounting contour with an active mounting surface of the mounting apparatus, the mounting apparatus comprising: a) an outer ring section for controllable fixing of the first substrate, and b) an inner ring section positioned inside of an inner edge of the outer edge secti…
Assignees
Inventors
Classifications
- H10P72/0428Primary
Electricity · mapped topic
Electricity · mapped topic
- H10P72/10Primary
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9613840B2 cover?
- This invention relates to a method and a device for temporary bonding of a first substrate with a second substrate. The device is comprised of a mounting apparatus for mounting of the first substrate on a mounting contour with an active mounting surface. The mounting apparatus has an outer ring section for controllable fixing of the first substrate. Deformation means are provided for controllab…
- Who is the assignee on this patent?
- Wagenleitner Thomas, Ev Group E Thallner Gmbh
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0428. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 04 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).