Electric-programmable magnetic module and picking-up and placement process for electronic devices

Patent metadata

Field	Value
Publication number	US-9607907-B2
Application number	US-201514954993-A
Country	US
Kind code	B2
Filing date	Nov 30, 2015
Priority date	Dec 1, 2014
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

A picking-up and placement process for electronic devices comprising: (a) providing a first substrate having a plurality of electronic devices formed thereon, the electronic devices being arranged in an array, and each of the electronic devices comprising a magnetic portion; (b) selectively picking-up parts of the electronic devices from the first substrate via a magnetic force generated from an electric-programmable magnetic module; and (c) bonding the parts of the electronic devices picked-up by the electric-programmable magnetic module with a second substrate.

First claim

What is claimed is:

1. A picking-up and placement process for electronic devices, comprising:
(a) providing a first substrate having a plurality of electronic devices formed thereon, the electronic devices being arranged in an array, and each of the electronic devices comprising a magnetic portion;
(b) selectively picking-up parts of the electronic devices from the first substrate via a magnetic force generated from an electric-programmable magnetic module; and
(c) bonding the parts of the electronic devices picked-up by the electric-programmable magnetic module with a second substrate,
wherein a method for fabricating the first substrate having the electronic devices thereon comprises:
forming a photoelectric semiconductor layer on a growth substrate;
forming a plurality of electrodes on the photoelectric semiconductor layer;
bonding the photoelectric semiconductor layer with the first substrate through an adhesive, wherein the adhesive adheres with the electrodes and the photoelectric semiconductor layer and is between the photoelectric semiconductor layer and the first substrate;
removing the growth substrate to expose a surface of the photoelectric semiconductor layer;
forming a sacrificial layer on the surface of the photoelectric semiconductor layer;
forming the magnetic portions on the sacrificial layer;
patterning the photoelectric semiconductor layer, the adhesive and the sacrificial layer to form the electronic devices, a plurality of sacrificial patterns disposed on the electronic devices and a plurality of adhesion patterns disposed between the electronic devices and the first substrate;
forming a supporting layer on the first substrate, wherein the supporting layer is between and connects the electronic devices, and each of the adhesion patterns is exposed by the supporting layer; and
removing the adhesion patterns to form a gap between each of the electronic devices and the first substrate.

2. The picking-up and placement process for electronic devices according to claim 1 , further comprising:
repeating step (a) through step (c) at least one time to bond the electronic devices formed on different first substrates with the second substrate.

3. The picking-up and placement process for electronic devices according to claim 2 , wherein the electronic devices formed on different first substrates emit different colored lights.

4. The picking-up and placement process for electronic devices according to claim 1 , further comprising:
thinning the photoelectric semiconductor layer after the growth substrate is removed and before the sacrificial layer is formed.

5. The picking-up and placement process for electronic devices according to claim 1 , further comprising:
removing the sacrificial patterns on the electronic devices that are bonded with the second substrate.

6. The picking-up and placement process for electronic devices according to claim 1 , further comprising:
thinning the photoelectric semiconductor layer after the growth substrate is removed and before the photoelectric semiconductor layer is patterned.

7. The picking-up and placement process for electronic devices according to claim 1 , wherein the electric-programmable magnetic module comprises a plurality of electromagnetic coils and each of the electromagnetic coils is respectively controlled.

8. The picking-up and placement process for electronic devices according to claim 7 , wherein the electromagnetic coils of the electric-programmable magnetic module are arranged corresponding to parts of the electronic devices on the first substrate.

9. The picking-up and placement process for electronic devices according to claim 1 , wherein the electric-programmable magnetic module comprises:
a micro electro mechanical system (MEMS) chip comprising a plurality of electromagnetic coils, each of the electromagnetic coils being individually controlled; and
a bonding equipment, wherein the MEMS chip is assembled with and carried by the bonding equipment.

10. The picking-up and placement process for electronic devices according to claim 9 , wherein the electromagnetic coils of the MEMS chip are arranged corresponding to parts of the electronic devices on the first substrate.

11. The picking-up and placement process for electronic devices according to claim 1 , further comprising:
performing an in-situ testing for the electronic devices during the electronic devices picked-up by the electric-programmable magnetic module are bonded with the second substrate.

12. The picking-up and placement process for electronic devices according to claim 11 , further comprising:
when at least one failed electronic device is inspected by the in-situ testing, de-bonding the at least one failed electronic device from the second substrate and recording a position information of the failed electronic device; and
picking-up and bonding at least one of the remaining electronic devices from the first substrate to the second substrate by the electric-programmable magnetic module according the position information.

13. The picking-up and placement process for electronic devices according to claim 1 , further comprising:
performing a testing for the electronic devices after the electronic devices picked-up by the electric-programmable magnetic module are bonded with the second substrate.

14. The picking-up and placement process for electronic devices according to claim 13 , further comprising:
when at least one failed electronic device is inspected by the testing, de-bonding the at least one failed electronic device from the second substrate and recording a position information of the failed electronic device; and
picking-up and bonding at least one of the remaining electronic devices from the first substrate to the second substrate by the electric-programmable magnetic module according the position information.

15. A picking-up and placement process for electronic devices, comprising:
(a) providing a first substrate having a plurality of electronic devices formed thereon, the electronic devices being arranged in an array, and each of the electronic devices comprising a magnetic portion;
(b) selectively picking-up parts of the electronic devices from the first substrate via a magnetic force generated from an electric-programmable magnetic module; and
(c) bonding the parts of the electronic devices picked-up by the electric-programmable magnetic module with a second substrate,
wherein a method for fabricating the first substrate having the electronic devices thereon comprises:
forming a photoelectric semiconductor layer on a growth substrate;
forming a plurality of electrodes on the photoelectric semiconductor layer;
bonding the photoelectric semiconductor layer with the first substrate through an adhesive, wherein the adhesive adheres with the electrodes and the photoelectric semiconductor layer and is between the photoelectric semiconductor layer and the first substrate;
removing the growth substrate from the photoelectric semiconductor layer;
patterning the photoelectric semiconductor layer and the adhesive to form the electronic devices and a plurality of adhesive patterns disposed under the electronic devices;
forming a supporting layer on the first substrate, wherein the supporting layer is between and connects the electronic devices, and each of the adhesion patterns is exposed by the supporting layer; and
removing the adhesion patterns to form a gap between each of the electronic devices and the first substrate.

16. The picking-up and placement process for electronic devices according to claim 15 , further

Assignees

• Ind Tech Res Inst
• Playnitride Inc

Inventors

• Wu Ming-Hsien
• Fang Yen-Hsiang
• Chao Chia-Hsin

Classifications

• H10W72/0711

  Apparatus therefor · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10P72/7434

  used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate · CPC title

• H10P72/7428

  used to support diced chips prior to mounting · CPC title

• H10P72/7426

  used as a support during build up manufacturing of active devices · CPC title