Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Method and structure for receiving a micro device
US8933433B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8933433-B2 |
| Application number | US-201213562184-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 30, 2012 |
| Priority date | Jul 30, 2012 |
| Publication date | Jan 13, 2015 |
| Grant date | Jan 13, 2015 |
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Abstract
Official abstract text for this publication.
A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
First claim
Opening claim text (preview).
What is claimed is: 1. A structure comprising: a substrate; a conductive layer on the substrate; a micro light emitting diode (LED) device on the conductive layer, wherein the micro LED device comprises: a micro p-n diode including sidewalls and a to surface; a metallization stack between the micro p-n diode and the conductive layer; and a quantum well layer within the micro p-n diode; a passivation layer comprising a thermoset or thermoplastic material laterally surr…
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Electricity · mapped topic
Electricity · mapped topic
- H10W90/00Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US8933433B2 cover?
- A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is …
- Who is the assignee on this patent?
- Higginson John A, Bibl Andreas, Hu Hsin-Hua, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 13 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).