Method of producing displacement plating precursor

Patent metadata

Field	Value
Publication number	US-9601782-B2
Application number	US-201213984052-A
Country	US
Kind code	B2
Filing date	Feb 13, 2012
Priority date	Feb 17, 2011
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

A method of producing a displacement plating precursor, including a deposition step of depositing a Cu layer on a surface of a core particle formed of Pt or a Pt alloy by contacting a Cu ion-containing acidic aqueous solution with at least a portion of a Cu electrode, and contacting the Cu electrode with the core particle or with a composite, in which the core particle is supported on an electroconductive support, within the acidic aqueous solution or outside the acidic aqueous solution, and moreover contacting the core particle with the acidic aqueous solution under an inert gas atmosphere.

First claim

The invention claimed is:

1. A method of producing a displacement plating precursor, comprising:
a deposition step of depositing a Cu layer on a surface of a core particle formed of Pt or a Pt alloy, without the use of an external power source, by
contacting a Cu ion-containing acidic aqueous solution with at least a portion of a Cu electrode, and
contacting the Cu electrode with the core particle or with a composite, in which the core particle is supported on an electroconductive support, within the acidic aqueous solution or outside the acidic aqueous solution, and
moreover contacting the core particle with the acidic aqueous solution under an inert gas atmosphere.

2. The method of producing a displacement plating precursor according to claim 1 , wherein the core particle has a diameter of 2 to 10 nm.

3. The method of producing a displacement plating precursor according to claim 1 , wherein a Cu ion concentration in the acidic aqueous solution is from at least 1 mM to not more than a saturation concentration.

4. The method of producing a displacement plating precursor according to claim 3 , wherein the Cu ion concentration in the acidic aqueous solution is less than or equal to 90% of the saturation concentration.

5. The method of producing a displacement plating precursor according to claim 1 , wherein pH of the acidic aqueous solution is from at least 1 to not more than 4.

6. The method of producing a displacement plating precursor according to claim 1 , wherein the deposition step includes deposition of the Cu layer on the surface of the core particle by using any of (a) a method in which the acidic aqueous solution, the core particles or a powder of the composite, and a solid that functions as the Cu electrode and that is formed of Cu or a Cu alloy are introduced into a vessel and the acidic aqueous solution is stirred; (b) a method in which a Cu layer or a Cu alloy layer that functions as the Cu electrode is formed on at least an interior wall surface of a vessel, the acidic aqueous solution and the core particles or a powder of the composite are introduced into this vessel, and the acidic aqueous solution is stirred; (c) a method in which a solid that functions as the Cu electrode and that is formed of Cu or a Cu alloy is filled into a vessel that is open at both ends and a dispersion prepared by dispersing the core particles or a powder of the composite in the acidic aqueous solution is flowed through the interior of this vessel; and (d) a method in which a dispersion prepared by dispersing the core particles or a powder of the composite in the acidic aqueous solution is sprayed onto a surface of a solid that functions as the Cu electrode and that is formed Cu or a Cu alloy.

Assignees

• Murata Hajime
• Nagai Tomoyuki
• Morimoto Yu
• Ikai Toshihiro
• Toyota Motor Co Ltd

Inventors

• Murata Hajime
• Nagai Tomoyuki
• Morimoto Yu
• Ikai Toshihiro

Classifications

• H01M4/9041

  Metals or alloys (H01M4/92 takes precedence) · CPC title

• C25D3/58

  containing more than 50% by weight of copper · CPC title

• Y02E60/50

  Fuel cells · CPC title

• C25D17/12

  Shape or form (C25D17/14 takes precedence) · CPC title

• C25D3/38

  of copper · CPC title