Electric assembly including a bipolar switching device and a wide bandgap transistor
US-2017345917-A1 · Nov 30, 2017 · US
US9601283B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9601283-B2 |
| Application number | US-201414512897-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 13, 2014 |
| Priority date | Jan 9, 2012 |
| Publication date | Mar 21, 2017 |
| Grant date | Mar 21, 2017 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Embodiments of the invention provide IGBT circuit modules with increased efficiencies. These efficiencies can be realized in a number of ways. In some embodiments, the gate resistance and/or voltage can be minimized. In some embodiments, the IGBT circuit module can be switched using an isolated receiver such as a fiber optic receiver. In some embodiments, a single driver can drive a single IGBT. And in some embodiments, a current bypass circuit can be included. Various other embodiments of the invention are disclosed.
Opening claim text (preview).
What is claimed is: 1. An IGBT circuit module comprising a circuit board; an IGBT coupled with the circuit board having a gate, a collector, and an emitter; a driver that provides current to the gate of the IGBT coupled with the circuit board; and a plurality of traces, wherein a first trace of the plurality of traces electrically couples the gate and the driver, wherein the length of the first trace is less than 1 cm, wherein the circuit module is configured to couple with a load between the emitter and the collector. 2. The IGBT circuit module according to claim 1 , wherein the IGBT includes a manufacturer-specified current rise time, and wherein the voltage at the gate is brought to a full voltage in a time less than the manufacturer-specified current rise time. 3. The IGBT circuit module according to claim 1 , wherein the IGBT includes a manufacturer-specified current fall time, and wherein the voltage at the gate is discharged in a time less than the manufacturer-specified current fall time. 4. The IGBT circuit module according to claim 1 , wherein the IGBT includes a manufacturer-specified current rise time, and wherein the voltage between the collector and the emitter is brought to a minimum voltage in a time less than the manufacturer-specified current rise time. 5. The IGBT circuit module according to claim 1 , wherein the IGBT circuit module includes an internal circuit module inductance that is greater than 50 nH. 6. The IGBT circuit module according to claim 5 , wherein the internal circuit module inductance includes either or both an internal IGBT inductance and a stray circuit module inductance. 7. The IGBT circuit module according to claim 1 , further comprising a current bypass circuit between the collector and the emitter. 8. The IGBT circuit module according to claim 1 , wherein the driver is coupled with a single IGBT. 9. The IGBT circuit module according to claim 1 , wherein the driver is coupled with a pre-driver. 10. The IGBT circuit module according to claim 1 , wherein the first trace directly couples the driver with the gate without an additional component. 11. The IGBT circuit module according to claim 1 , wherein the first trace directly couples the driver with the gate without a resistor. 12. The IGBT circuit module according to claim 1 , wherein the IGBT has a manufacturer-specified switching loss, and the switching loss of the IGBT circuit module is less than the manufacturer-specified switching loss. 13. The IGBT circuit module according to claim 1 , wherein the IGBT has a manufacturer-specified rise time, and the rise time of the IGBT circuit module is less than the manufacturer-specified rise time. 14. The IGBT circuit module according to claim 1 , wherein the IGBT has a manufacturer-specified fall time, and the fall time of the IGBT circuit module is less than the manufacturer-specified fall time. 15. The IGBT circuit module according to claim 1 , wherein the IGBT has a manufacturer specified turn-on delay time, and the turn-on delay time of the IGBT circuit module is less than the manufacturer specified turn-on delay time. 16. The IGBT circuit module according to claim 1 , wherein the IGBT has a manufacturer specified turn-off delay time, and the turn-off delay time of the IGBT circuit module is less than the manufacturer specified turn-off delay time. 17. The IGBT circuit module according to claim 1 , wherein the turn-off delay time is less than 100 ns. 18. The IGBT circuit module according to claim 1 , wherein the turn-on delay time is less than 40 ns. 19. An IGBT circuit module comprising a circuit board; an IGBT coupled with the circuit board having a gate, a collector, and an emitter; a driver that provides current to the gate of the IGBT coupled with the circuit board; and a plurality of traces, wherein a first trace of the plurality of traces electrically couples the gate and the driver, wherein the first trace has an inductance less than 100 nH, wherein the circuit module is configured to couple with a load between the emitter and the collector. 20. An IGBT circuit module comprising a circuit board; an IGBT coupled with the circuit board having a gate, a collector, and an emitter; a driver that provides current to the gate of the IGBT coupled with the circuit board; and a plurality of traces, wherein a first trace of the plurality of traces electrically couples the gate and the driver, wherein the first trace has an inductance less than 1 ohm, wherein the circuit module is configured to couple with a load between the emitter and the collector.
for devices provided for in groups H10D8/00 - H10D48/00 · CPC title
Inductive arrangements (H10W44/20 takes precedence) · CPC title
Means reducing energy consumption · CPC title
Circuits characterised by the use of more than one type of semiconductor device, e.g. BIMOS, composite devices such as IGBT · CPC title
in composite switches · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.