Semiconductor device
US-12068235-B2 · Aug 20, 2024 · US
for devices provided for in groups H10D8/00 - H10D48/00
for devices provided for in groups H10D8/00 - H10D48/00 · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W70/658 |
| Official title | {for devices provided for in groups H10D8/00 - H10D48/00} |
| Display label | for devices provided for in groups H10D8/00 - H10D48/00 |
| Total patents | 1,732 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 80 |
| 2016 | 146 |
| 2017 | 140 |
| 2018 | 88 |
| 2019 | 92 |
| 2020 | 137 |
| 2021 | 160 |
| 2022 | 189 |
| 2023 | 206 |
| 2024 | 247 |
| 2025 | 196 |
| 2026 | 51 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Power module and electrical device
US-2024235414-A1 · Jul 11, 2024 · US
Semiconductor device and mounting structure for semiconductor element
US-2024170353-A1 · May 23, 2024 · US
Method for manufacturing semiconductor device
US-2015380274-A1 · Dec 31, 2015 · US
Semiconductor device
US-2015380393-A1 · Dec 31, 2015 · US
Semiconductor power modules and devices
US-9224721-B2 · Dec 29, 2015 · US
Semiconductor device
US-2015371937-A1 · Dec 24, 2015 · US
Semiconductor chip including digital logic circuit including at least six transistors with some transistors forming cross-coupled transistor configuration and associated methods
US-9213792-B2 · Dec 15, 2015 · US
Semiconductor circuit and method for producing the semiconductor circuit
US-2015357303-A1 · Dec 10, 2015 · US
Power Semiconductor Package
US-2015340304-A1 · Nov 26, 2015 · US
Circuit substrate, electronic component mounting substrate and method for producing circuit substrate
US-2015342052-A1 · Nov 26, 2015 · US
Semiconductor module with low inductance load connections
US-2015342055-A1 · Nov 26, 2015 · US
Power semiconductor module having pattern laminated region
US-9196604-B2 · Nov 24, 2015 · US
Power amplifier modules including related systems, devices, and methods
US-2015326183-A1 · Nov 12, 2015 · US
Power amplifier modules including related systems, devices, and methods
US-2015326181-A1 · Nov 12, 2015 · US
Power amplifier modules including related systems, devices, and methods
US-2015326182-A1 · Nov 12, 2015 · US
Wiring board
US-2015313015-A1 · Oct 29, 2015 · US
Metallization having high power compatibility and high electrical conductivity
US-9173305-B2 · Oct 27, 2015 · US
Interposer defect coverage metric and method to maximize the same
US-9158881-B2 · Oct 13, 2015 · US
Power converter package including vertically stacked driver IC
US-9159703-B2 · Oct 13, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W70/658?
- CPC H10W70/658 is the Cooperative Patent Classification code for “for devices provided for in groups H10D8/00 - H10D48/00.”
- How many patents are filed under CPC H10W70/658 (for devices provided for in groups H10D8/00 - H10D48/00)?
- Our database includes 1,732 publications tagged with this CPC code.
- Is patent activity under CPC H10W70/658 growing?
- Publication counts under this code: 247 in 2024 vs 196 in 2025 (latest complete years).