Composition for metal electroplating comprising leveling agent

Patent metadata

Field	Value
Publication number	US-9598540-B2
Application number	US-201013510328-A
Country	US
Kind code	B2
Filing date	Nov 22, 2010
Priority date	Nov 27, 2009
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

A composition comprising a source of metal ions and at least one additive comprising at least one polyaminoamide represented by formula (I) or derivatives of a polyaminoamide of formula (I) obtainable by complete or partial protonation, N-quarternisation or acylation.

First claim

The invention claimed is:

1. A composition, comprising:
a source of copper ions; and
an additive comprising a polyaminoamide of formula (I):

or a derivative of a polyaminoamide of formula (I) obtained by complete or partial protonation,
wherein:
D 1 is, for each repeating unit 1 to p, independently a chemical bond or a divalent C 1 -C 20 -alkanediyl group which is optionally interrupted by at least one selected from the group consisting of a double bond and an imino group and/or is optionally, completely or partially, a constituent of a saturated or unsaturated carbocyclic 5- to 8-membered ring;
D 2 and D 3 are each independently a straight chain or branched C1 to C6 alkanediyl;
R 1 is, for each repeating unit 1 to n, independently R 2 , a C 1 -C 20 -alkyl, or a C 1 -C 20 -alkenyl, and optionally substituted with a hydroxyl or an alkoxycarbonyl;
R 2 is hydrogen;
E 1 and E 2 are each independently selected from the aroup consistina of (a) a nucleophilically displaceable leaving group X, (b) NH—C 1 -C 20 -alkyl or NH—C 1 -C 20 -alkenyl, (c) H—{NH-[D 2 -NR 1 ] n -D 3 -NH} or R 2 —{NR 2 -[D 2 -NR 1 ] n -D 3 -NH}, (d) C 1 -C 20 -alkyl-CO—{NH-[D 2 -NR 2 ] n -D 3 -NH}, and (e) C 1 -C 20 -alkenyl-CO—{NH-[D 2 -NR 2 ] n -D 3 -NH};
n is an integer from 1 to 250;
p is an integer from 2 to 150; and
q is from 0.01 to 5.

2. The composition of claim 1 , wherein:
R 1 is R 2 ; and
R 14 is hydrogen or methyl.

3. The composition of claim 1 , wherein:
D 1 is a chemical bond or a C 1 -C 20 -alkanediyl group;
D 2 and D 3 are each independently (CH 2 ) m ;
R 1 is R 2 or methyl;
E 1 and E 2 are each independently OH, an alkoxy, a halogen, H—{NH-[D 2 -NR 1 ] n -D 3 -NH}, or R 2 —{NR 2 -[D 2 -NR 1 ] n -D 3 -NH};
m is 2 or 3;
n is 1 or 2;
p is an integer from 5 to 70; and
q is a number from 0.1 to 2.

4. The composition of claim 1 , wherein the polyaminoamide is obtained by reacting a polyalkylenepolyamine with a dicarboxylic acid.

5. The composition of claim 4 , wherein the polyalkylenepolyamine is selected from the group consisting of diethylenetriamine, triethylenetetramine, tetraethylenpentamine, pentaethylenehexamine, diaminopropylethylenediamine, ethylenepropylenetriamine, 3-(2-aminoethyl)-aminopropylamine, dipropylenetriamine, a polyethyleneimine, and mixtures thereof.

6. The composition of claim 4 , wherein the dicarboxylic acid is selected from the group of oxalic acid, malonic acid, succinic acid, tartaric acid, maleic acid, itaconic acid, glutaric acid, adipic acid, suberic acid, sebacic acid, phthalic acid and terephthalic acid, iminodiacetic acid, aspartic acid, glutamic acid, and mixtures thereof.

7. The composition of claim 1 , further comprising:
an accelerating agent.

8. The composition of claim 1 , further comprising:
a suppressing agent.

9. The composition of claim 1 , in the form of an electroplating bath.

10. A process for depositing a metal layer on a substrate, the process comprising:
a) contacting a metal plating bath comprising a composition of claim 1 with a substrate; and
b) applying a current density to the substrate for a time sufficient to deposit a copper layer onto the substrate.

11. The process of claim 10 , wherein the substrate comprises micrometer or submicrometer sized features and the deposition is performed to fill the micrometer or submicrometer sized features.

12. The process of claim 11 , wherein the micrometer or submicrometer-sized features have at least one selected from the group consisting of a size from 1 to 1000 nm and an aspect ratio of 4 or more.

13. The composition of claim 1 , wherein R 1 is, for each repeating unit 1 to n, independently R 2 , a C 1 -C 20 -alkyl, or a C 1 -C 20 -alkenyl.

14. The composition of claim 1 , wherein E 1 and E 2 are each independently selected from the group consisting of (b) NH—C 1 -C 20 -alkyl or NH—C 1 -C 20 -alkenyl, (c) H—{NH-[D 2 -NR 1 ] n -D 3 -NH} or R 2 —{NR 2 -[D 2 -NR 1 ] n -D 3 -NH}, (d) C 1 -C 20 -alkyl-CO—{NH-[D 2 -NR 2 ] n -D 3 -NH}, and (e) C 1 -C 20 -alkenyl-CO—{NH-[D 2 -NR 2 ] n -D 3 -NH}.

15. The process of claim 10 , wherein the polyaminoamide of formula (I) functions as a leveling agent.

16. The process of claim 10 , wherein overplating is reduced or substantially eliminated.

17. The process of claim 10 , wherein the ratio a/b as defined in FIG. 2 a is 1.5 or less.

18. The process of claim 10 , wherein the ratio a/b as defined in FIG. 2 a is 1.2 or less.

19. The process of claim 10 , wherein the ratio alb as defined in FIG. 2 a is 1.1 or less.

20. The composition claim 1 , which comprises a copper salt.

21. The composition of claim 1 , which comprises at least one of copper sulfate, copper chloride, copper acetate, copper citrate, copper nitrate, copper fluoroborate, copper methane sulfonate, copper phenyl sulfonate and copper p-toluene sulfonate.

Assignees

• Roeger-Goepfert Cornelia
• Raether Roman Benedikt
• Mayer Dieter
• Emnet Charlotte
• Arnold Marco
• Basf Se

Inventors

• Roeger-Goepfert Cornelia
• Raether Roman Benedikt
• Mayer Dieter
• Emnet Charlotte
• Arnold Marco

Classifications

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• H10W20/056

  by filling conductive material into holes, grooves or trenches · CPC title

• H01L2924/00

  Electricity · mapped topic

• C08L79/02

  Polyamines · CPC title

• H01L21/2885

  Electricity · mapped topic