Power module comprising two substrates and method of manufacturing the same
US-11574889-B2 · Feb 7, 2023 · US
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Winter Frank patents
Winter Frank is listed as an inventor on 11 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Winter Frank |
| Total patents | 11 |
| First publication | Feb 12, 2015 |
| Latest publication | Feb 7, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Electronic module and method of manufacturing the same
US-9847274-B2 · Dec 19, 2017 · US
Electronic module and method of manufacturing the same
US-2017154835-A1 · Jun 1, 2017 · US
Electronic module and method of manufacturing the same
US-2017092563-A1 · Mar 30, 2017 · US
Electronic module and method of manufacturing the same
US-9589922-B2 · Mar 7, 2017 · US
Substrate, chip arrangement, and method for manufacturing the same
US-9585241-B2 · Feb 28, 2017 · US
Electronic module and method of manufacturing the same
US-9532459-B2 · Dec 27, 2016 · US
Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip
US-9275926-B2 · Mar 1, 2016 · US
Electronic module and method of manufacturing the same
US-2015264796-A1 · Sep 17, 2015 · US
Substrate, chip arrangement, and method for manufacturing the same
US-2015085446-A1 · Mar 26, 2015 · US
Recent patents
Latest publications not already listed above.
Electronic module and method of manufacturing the same
US-2015043169-A1 · Feb 12, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 11 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/07336 | 7 |
| H10W74/016 | 7 |
| H10W40/778 | 6 |
| H05K1/185 | 5 |
| H10W74/00 | 5 |