Raw material gas supply method

US9563209B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9563209-B2
Application numberUS-201414168549-A
CountryUS
Kind codeB2
Filing dateJan 30, 2014
Priority dateJan 31, 2013
Publication dateFeb 7, 2017
Grant dateFeb 7, 2017

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A raw material gas supply method for use in a film forming apparatus which forms a film on a substrate, includes supplying a carrier gas to a gas phase zone defined inside a raw material container accommodating a liquid or solid raw material, vaporizing the raw material, supplying a raw material gas containing the vaporized raw material from the raw material container to the film forming apparatus via a raw material gas supply path, measuring a flow rate of the vaporized raw material flowing through the raw material gas supply path, comparing the flow rate of the vaporized raw material obtained by the flow rate measurement unit with a predetermined target value, and controlling an internal pressure of the raw material container to be increased when the flow rate is higher than the predetermined target value, and to be decreased when the is lower than the predetermined target value.

First claim

Opening claim text (preview).

What is claimed is: 1. A raw material gas supply method for use in a film forming apparatus which forms a film on a substrate, the method comprising: supplying a carrier gas to a gas phase zone defined inside a raw material container, the raw material container accommodating a liquid or solid raw material; vaporizing the raw material; supplying a raw material gas containing the vaporized raw material from the raw material container to the film forming apparatus via a raw material gas supply path; measuring a flow rate of the vaporized raw material flowing through the raw material gas supply path; comparing the measured flow rate of the vaporized raw material with a predetermined target value; controlling an internal pressure of the raw material container to be increased when the measured flow rate of the vaporized raw material is higher than the predetermined target value, and to be decreased when the measured flow rate of the vaporized raw material is lower than the predetermined target value; supplying a buffer gas to a downstream side of a position at which the pressure control gas is supplied in the raw material gas supply path; and controlling a supply amount of the pressure control gas and a supply amount of the buffer gas such that a sum of the supply amount of the pressure control gas and the supply amount of the buffer gas becomes constant, wherein controlling an internal pressure of the raw material container is preformed by supplying a pressure control gas to the raw material gas supply path. 2. The method of claim 1 , wherein controlling an internal pressure of the raw material container is performed by adjusting an opening degree of a pressure control valve provided in the raw material gas supply path. 3. A non-transitory storage medium storing a program for controlling a raw material gas supply device for use in a film forming apparatus configured to form a film on a substrate, wherein the program causes the raw material gas supply device to perform the method of claim 1 .

Assignees

Inventors

Classifications

  • by evaporation using carrier gas in contact with the source material (C23C16/4486 takes precedence) · CPC title

  • By fluid pressure · CPC title

  • G05D16/00Primary

    Control of fluid pressure · CPC title

  • by action on flow sources (G05D7/0688, G05D7/0694 take precedence) · CPC title

  • Pilot or servo controlled · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9563209B2 cover?
A raw material gas supply method for use in a film forming apparatus which forms a film on a substrate, includes supplying a carrier gas to a gas phase zone defined inside a raw material container accommodating a liquid or solid raw material, vaporizing the raw material, supplying a raw material gas containing the vaporized raw material from the raw material container to the film forming appara…
Who is the assignee on this patent?
Tokyo Electron Ltd
What technology area does this patent fall under?
Primary CPC classification C23C16/4481. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 07 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).