Adjusting a substrate polishing condition

Patent metadata

Field	Value
Publication number	US-9561575-B2
Application number	US-201514964132-A
Country	US
Kind code	B2
Filing date	Dec 9, 2015
Priority date	Sep 24, 2012
Publication date	Feb 7, 2017
Grant date	Feb 7, 2017

Abstract

A polishing apparatus polishes a substrate by moving the substrate and a polishing pad relative to each other. The apparatus includes: an elastic modulus measuring device configured to measure an elastic modulus of the polishing pad, and a polishing condition adjustor configured to adjust polishing conditions of the substrate based on a measured value of the elastic modulus. The polishing conditions include pressure of a retaining ring, arranged around the substrate, exerted on the polishing pad and a temperature of the polishing pad.

First claim

What is claimed is:

1. A method for adjusting a temperature of a polishing pad, said method comprising:
providing a polishing pad to polish a substrate, a top ring to hold the substrate, and a temperature adjusting mechanism to control a temperature of the polishing pad;
measuring an elastic modulus of the polishing pad;
adjusting the temperature of the polishing pad so that a target value of the elastic modulus of the polishing pad is reached, the target value being determined based on a relationship between a measured value of the elastic modulus of the polishing pad and a size of a surface of the substrate; and
repeating said measuring and said adjusting until the measured value of the elastic modulus corresponds with the target value.

2. The method for adjusting the temperature of the polishing pad according to claim 1 , wherein the relationship is determined in advance by:
preparing a plurality of the polishing pads, the elastic modulus of each individual polishing pad being different from any other polishing pad,
selecting one of the polishing pads,
measuring a size of surface steps of a sample substrate,
repeating selecting of one of the polishing pads, polishing of the sample substrate on the selected one of the polishing pads, and measuring of the size of the surface steps of the sample substrate, and
determining an optimum elastic modulus of each of the polishing pads at which the size of the surface steps is minimized.

3. The method for adjusting the temperature of the polishing pad according to claim 1 , wherein the temperature of the polishing pad is regulated such that the elastic modulus becomes equal to a predetermined target value.

4. The method for adjusting the temperature of the polishing pad according to claim 1 , wherein the temperature of the polishing pad is regulated by bringing a temperature-regulating medium into contact with the polishing pad.

5. The method for adjusting the temperature of the polishing pad according to claim 4 , wherein the temperature-regulating medium is brought into contact with a plurality of regions of the polishing pad separately.

6. The method for adjusting the temperature of the polishing pad according to claim 5 , wherein at least one of the plurality of regions is a region that contacts a peripheral portion of the substrate.

7. The method for adjusting the temperature of the polishing pad according to claim 1 , wherein the measuring an elastic modulus of the polishing pad comprises measuring an elastic modulus of the polishing pad during polishing of the substrate.

8. The method for adjusting the temperature of the polishing pad according to claim 7 , wherein the measuring an elastic modulus of the polishing pad comprises measuring an elastic modulus of the polishing pad in a region upstream of the substrate with respect to a movement direction of the polishing pad.

9. The method for adjusting the temperature of the polishing pad according to claim 1 , wherein the measuring an elastic modulus of the polishing pad comprises measuring an elastic modulus of the polishing pad before polishing of the substrate.

10. The method for adjusting the temperature of the polishing pad according to claim 1 , wherein the measuring an elastic modulus of the polishing pad comprises:
applying a force to a surface of the polishing pad to deform the polishing pad,
measuring an amount of deformation of the polishing pad, and
dividing the force by the amount of deformation of the polishing pad to determine the elastic modulus of the polishing pad.

11. The method for adjusting the temperature of the polishing pad according to claim 1 , wherein measuring the elastic modulus of the polishing pad comprises blowing a pressurized gas onto the polishing pad to form a recess in the polishing pad and measuring a depth of the recess.

Assignees

• Ebara Corp

Inventors

• Motoshima Yasuyuki
• Maruyama Toru

Classifications

• B24B49/14

  taking regard of the temperature during grinding · CPC title

• B24B9/065

  of thin, brittle parts, e.g. semiconductors, wafers · CPC title

• B24B49/03

  according to the final size of the previously ground workpiece · CPC title

• B24B49/10

  involving electrical means (B24B49/02, B24B49/08 take precedence) · CPC title

• B24B37/015

  Temperature control · CPC title