Substrate polishing apparatus with contact extension or adjustable stop

Patent metadata

Field	Value
Publication number	US-11904429-B2
Application number	US-202117495679-A
Country	US
Kind code	B2
Filing date	Oct 6, 2021
Priority date	Oct 13, 2020
Publication date	Feb 20, 2024
Grant date	Feb 20, 2024

Abstract

An apparatus for chemical mechanical polishing (CMP) of a substrate is described herein. The apparatus includes an extension disposed between a retaining ring and a chucking membrane. The extension is disposed radially outward from the edge of the substrate and is configured to contact the retaining ring during substrate processing. The extension provides a repeatable and controlled point of contact between the retaining ring and the chucking membrane. The extension may have multiple configurations, such that the contact point between the retaining ring and the chucking membrane is set at a pre-determined location or such that the contact point is moveable by an adjustable stop.

First claim

What is claimed is:

1. An apparatus for substrate polishing comprising:
a housing member;
a carrier member coupled to the housing member, the carrier member forming at least a portion of a carrier volume;
a support plate disposed radially inside of the carrier volume and coupled to the carrier member; and
a substrate chuck element coupled to the support plate and comprising:
a first membrane comprising a plurality of channel regions; and
a second membrane coupled to a bot…

Assignees

• Applied Materials Inc

Inventors

• Zuniga Steven M
• Nagengast Andrew
• Gurusamy Jay

Classifications

• H10P72/0428

  Electricity · mapped topic

• B24B37/005 Primary

  Operations & Transport · mapped topic

• B24B37/02

  Operations & Transport · mapped topic

• B24B37/12

  Operations & Transport · mapped topic

• B24B37/20

  Operations & Transport · mapped topic