Systems and methods for processing semiconductor wafers using front-end processed wafer global geometry metrics
US-2026063568-A1 · Mar 5, 2026 · US
according to the final size of the previously ground workpiece
according to the final size of the previously ground workpiece · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B24B49/03 |
| Official title | according to the final size of the previously ground workpiece |
| Display label | according to the final size of the previously ground workpiece |
| Total patents | 46 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 5 |
| 2016 | 2 |
| 2017 | 2 |
| 2018 | 2 |
| 2019 | 6 |
| 2020 | 2 |
| 2021 | 1 |
| 2022 | 3 |
| 2023 | 6 |
| 2024 | 6 |
| 2025 | 8 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Systems and methods for enhanced wafer manufacturing
US-2026051038-A1 · Feb 19, 2026 · US
Surface processing of semiconductor workpieces
US-12525457-B2 · Jan 13, 2026 · US
Surface Processing of Semiconductor Workpieces
US-2025379058-A1 · Dec 11, 2025 · US
Systems and methods for processing semiconductor wafers using front-end processed wafer edge geometry metrics
US-12487185-B2 · Dec 2, 2025 · US
Semiconductor wafers using front-end processed wafer global geometry metrics
US-12385850-B2 · Aug 12, 2025 · US
Method of double-side polishing work, method of producing work, and double-side polishing apparatus for a work
US-12311496-B2 · May 27, 2025 · US
Surface height measurement method using dummy disk
US-12257666-B2 · Mar 25, 2025 · US
Waviness prediction device, waviness prediction method, processing method for polishing target article, and program
US-2025058425-A1 · Feb 20, 2025 · US
Device for measuring wafer polishing amount, and measurement method therefor
US-2025041988-A1 · Feb 6, 2025 · US
Wafer grinding method
US-2025018531-A1 · Jan 16, 2025 · US
Ultra-precision machining method
US-2024316658-A1 · Sep 26, 2024 · US
Substrate processing control system, substrate processing control method, and program
US-2024316720-A1 · Sep 26, 2024 · US
Method of creating responsiveness profile of polishing rate of workpiece, polishing method, and computer-readable storage medium storing program
US-2024253181-A1 · Aug 1, 2024 · US
Substrate processing control system, substrate processing control method, and program
US-12036634-B2 · Jul 16, 2024 · US
Substrate polishing device, substrate processing apparatus, method, and storage medium
US-2024217060-A1 · Jul 4, 2024 · US
Method for producing textured plated steel sheet, and apparatus for producing textured plated steel sheet
US-2024149394-A1 · May 9, 2024 · US
Surface height measurement method using dummy disk
US-2023415299-A1 · Dec 28, 2023 · US
Workpiece processing apparatus including a resin coater and a resin grinder
US-11819975-B2 · Nov 21, 2023 · US
Method of double-side polishing work, method of producing work, and double-side polishing apparatus for a work
US-2023201993-A1 · Jun 29, 2023 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B24B49/03?
- CPC B24B49/03 is the Cooperative Patent Classification code for “according to the final size of the previously ground workpiece.”
- How many patents are filed under CPC B24B49/03 (according to the final size of the previously ground workpiece)?
- Our database includes 46 publications tagged with this CPC code.
- Is patent activity under CPC B24B49/03 growing?
- Publication counts under this code: 6 in 2024 vs 8 in 2025 (latest complete years).