Semiconductor device and method of forming interposer with opening to contain semiconductor die
US-9875911-B2 · Jan 23, 2018 · US
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Chi Heejo patents
Chi Heejo holds 19 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 19 |
| Recent patents | 0 |
| First publication | Feb 10, 2015 |
| Latest publication | Jan 23, 2018 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
US-9735113-B2 · Aug 15, 2017 · US
Integrated circuit packaging system with coreless substrate and method of manufacture thereof
US-9673171-B1 · Jun 6, 2017 · US
Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint
US-9558965-B2 · Jan 31, 2017 · US
Integrated circuit packaging system with support structure and method of manufacture thereof
US-9502267-B1 · Nov 22, 2016 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Semiconductor device and method of forming interposer with opening to contain semiconductor die
US-9875911-B2 · Jan 23, 2018 · US
Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
US-9735113-B2 · Aug 15, 2017 · US
Integrated circuit packaging system with coreless substrate and method of manufacture thereof
US-9673171-B1 · Jun 6, 2017 · US
Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint
US-9558965-B2 · Jan 31, 2017 · US
Integrated circuit packaging system with support structure and method of manufacture thereof
US-9502267-B1 · Nov 22, 2016 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 19 |
| Cross-Sectional Technologies | 1 |