Packaging for ultraviolet optoelectronic device

Patent metadata

Field	Value
Publication number	US-9548429-B2
Application number	US-201514708478-A
Country	US
Kind code	B2
Filing date	May 11, 2015
Priority date	May 10, 2014
Publication date	Jan 17, 2017
Grant date	Jan 17, 2017

Abstract

A solution for packaging an optoelectronic device using an ultraviolet transparent polymer is provided. The ultraviolet transparent polymer material can be placed adjacent to the optoelectronic device and/or a device package on which the optoelectronic device is mounted. Subsequently, the ultraviolet transparent polymer material can be processed to cause the ultraviolet transparent polymer material to adhere to the optoelectronic device and/or the device package. The ultraviolet transparent polymer can be adhered in a manner that protects the optoelectronic device from the ambient environment.

First claim

What is claimed is:

1. A method of packaging a set of optoelectronic devices, the method comprising:
obtaining a device package including the set of optoelectronic devices mounted on a first surface, wherein each optoelectronic device in the set of optoelectronic devices is located within a set of cavities of the device package;
placing an ultraviolet transparent polymer film adjacent to each optoelectronic device in the set of optoelectronic devices on the first surface; and
processing, without melting, the ultraviolet transparent polymer film to cause the ultraviolet transparent polymer film to collapse and adhere to at least a portion of the first surface such that the device package and the ultraviolet transparent polymer film seal a portion of each optoelectronic device in the set of optoelectronic devices located on the first surface from an ambient environment, wherein the processing includes creating a pressure difference between a top surface of the ultraviolet transparent polymer film and the set of cavities sufficient to cause the ultraviolet transparent polymer film to collapse onto each optoelectronic device in the set of optoelectronic devices.

2. The method of claim 1 , wherein the set of optoelectronic devices includes a plurality of optoelectronic devices, and wherein the method further includes physically separating the device package between at least some of the plurality of optoelectronic devices, wherein the portion of each optoelectronic device in the set of optoelectronic devices remains sealed from the ambient environment after the separating.

3. The method of claim 1 , wherein the set of optoelectronic devices includes a plurality of optoelectronic devices, and wherein the processing seals at least two of the plurality of optoelectronic devices within a single sealed area.

4. The method of claim 1 , wherein the processing includes at least one of: applying a pressure to the film and the device package or heating the film at least at a location of the film contacting the device package.

5. The method of claim 1 , wherein the processing includes heating the device package and the ultraviolet transparent polymer film to a first temperature below a melting point of the ultraviolet transparent polymer film.

6. The method of claim 5 , wherein the processing further includes:
maintaining the first temperature for a first period of time; and
applying a pressure to the ultraviolet transparent polymer film and the device package after the first period of time.

7. The method of claim 6 , wherein the processing further includes:
increasing the temperature after the first period of time to a second temperature higher than the first temperature, wherein the second temperature is below the melting point of the ultraviolet transparent polymer film; and
maintaining the temperature at the second temperature for a second period of time after the increasing, wherein the pressure is applied after the second period of time has started.

8. The method of claim 7 , wherein the increasing includes gradually raising the temperature no faster than one degree per minute.

9. The method of claim 1 , wherein the processing includes applying a pressure to at least a portion of the ultraviolet transparent polymer film with a stamp tool.

10. The method of claim 9 , wherein the method further comprises applying an adhesive material to at least one of: the ultraviolet transparent polymer film or the device package, in areas at which the ultraviolet transparent polymer film will directly contact the device package prior to the processing.

11. The method of claim 1 , wherein the ultraviolet transparent polymer film includes a plurality of particles of an ultraviolet transparent polymer material.

12. The method of claim 1 , wherein each optoelectronic device in the set of optoelectronic devices is located within a unique cavity in the set of cavities of the device package, and wherein each cavity in the device package that contains an optoelectronic device includes a set of openings located about a periphery of the optoelectronic device configured to allow air to escape from the cavity when a top surface of the cavity is covered with the ultraviolet transparent polymer film.

13. The method of claim 12 , wherein the processing includes removing air from the set of openings in each cavity using a vacuum chamber.

14. The method of claim 1 , further comprising attaching at least one optoelectronic device in the set of optoelectronic devices to a structure using the ultraviolet transparent polymer film.

15. The method of claim 1 , wherein the placing and processing are repeated for at least one additional ultraviolet transparent polymer film.

16. The method of claim 15 , wherein the ultraviolet transparent polymer film is an adhesive film and the at least one additional ultraviolet transparent polymer film is an environmentally protective film.

17. A method of packaging an optoelectronic device, the method comprising:
mounting the optoelectronic device onto a first surface of a device package;
placing an ultraviolet transparent polymer film adjacent to the optoelectronic device on the first surface; and
processing the ultraviolet transparent polymer film to cause the ultraviolet transparent polymer film to adhere to at least a portion of the first surface and at least a portion of the optoelectronic device such that the device package and the ultraviolet transparent polymer film seal a portion of the optoelectronic device from an ambient environment, wherein the processing includes:
heating the ultraviolet transparent polymer film to a first temperature that causes the ultraviolet transparent polymer film to experience a phase change and a change of transparent properties;
maintaining the heating at the first temperature until the ultraviolet transparent polymer film is at least twenty percent more transparent to visible and/or ultraviolet radiation than prior to the phase change; and
heating the ultraviolet transparent polymer film to a second temperature to adhere the ultraviolet transparent polymer film to the first surface of the device package and at least a portion of the optoelectronic device after the ultraviolet transparent polymer film is at least twenty percent more transparent to visible and/or ultraviolet radiation.

18. The method of claim 17 , wherein the processing includes:
heating the device package and the film to cause the film to become flowable;
monitoring the film to determine when the film has flowed sufficiently; and
allowing the film to cure after sufficient flow has occurred.

19. A method of packaging an optoelectronic device, the method comprising:
placing an ultraviolet transparent polymer film adjacent to a first surface of a device package on which an optoelectronic device is mounted, wherein the device package includes a cavity containing the optoelectronic device and a set of openings formed in the cavity located about a periphery of the optoelectronic device; and
processing the ultraviolet transparent polymer film to cause the ultraviolet transparent polymer film to adhere to at least a portion of the first surface and at least a portion of the optoelectronic device such that the device package and the ultraviolet transparent polymer film seal a portion of the optoelectronic device from an ambient environment, wherein the processing includes:
heating the ultraviolet transparent polymer film to cause the film to become flowable;
monitoring the ultraviolet transparent polymer film to determine when the film has

Assignees

• Sensor Electronic Tech Inc

Inventors

• Shatalov Maxim S
• Smetona Saulius
• Dobrinsky Alexander
• Shur Michael

Classifications

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W72/0198

  batch processes · CPC title

• H01L2933/0025

  Electricity · mapped topic

• H01L24/97

  Electricity · mapped topic

• H01L2224/14

  Electricity · mapped topic