Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Substrate for LED, LED module, and LED bulb
US9166133B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9166133-B2 |
| Application number | US-201314381251-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 11, 2013 |
| Priority date | Mar 15, 2012 |
| Publication date | Oct 20, 2015 |
| Grant date | Oct 20, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
LED substrate of the present invention includes: translucent substrate body-in which an LED chip is disposed on a front face; and heat dissipation path provided in substrate body to dissipate heat generated in the LED chip. Substrate body includes a through hole that penetrates through the substrate body from the front face on which the LED chip is provided to a back face. Heat dissipation path includes: heat transfer path section provided in the through hole; and heat dissipation pattern section provided on the back face of substrate body, and connected to heat transfer path section. Thus, LED substrate having superior heat dissipation is realized.
First claim
Opening claim text (preview).
The invention claimed is: 1. An LED substrate comprising: a translucent substrate body in which an LED chip is disposed on a front face; and a heat dissipation path provided in the substrate body to dissipate heat generated in the LED chip, wherein the substrate body includes a through hole that penetrates through the substrate body from the front face on which the LED chip is provided to a back face, wherein the heat dissipation path includes a heat transfer path section…
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Classifications
Electricity · mapped topic
- H10W90/00Primary
Electricity · mapped topic
Electricity · mapped topic
- H10H20/8582Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9166133B2 cover?
- LED substrate of the present invention includes: translucent substrate body-in which an LED chip is disposed on a front face; and heat dissipation path provided in substrate body to dissipate heat generated in the LED chip. Substrate body includes a through hole that penetrates through the substrate body from the front face on which the LED chip is provided to a back face. Heat dissipation path…
- Who is the assignee on this patent?
- Panasonic Corp, Panasonic Ip Man Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 20 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).