Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices
US-12142594-B2 · Nov 12, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L24/97 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 4,706 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 403 |
| 2016 | 488 |
| 2017 | 545 |
| 2018 | 552 |
| 2019 | 595 |
| 2020 | 558 |
| 2021 | 351 |
| 2022 | 301 |
| 2023 | 227 |
| 2024 | 305 |
| 2025 | 317 |
| 2026 | 64 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor package
US-2024297150-A1 · Sep 5, 2024 · US
Power leadframe package with lead sidewall surface that is fully solder wettable
US-2024274572-A1 · Aug 15, 2024 · US
Semiconductor package using a coreless signal distribution structure
US-11869879-B2 · Jan 9, 2024 · US
Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages
US-9224674-B2 · Dec 29, 2015 · US
Method for producing optoelectronic semiconductor components, leadframe assemblage and optoelectronic semiconductor component
US-9219210-B2 · Dec 22, 2015 · US
Reflecting resin sheet, light emitting diode device and producing method thereof
US-9214611-B2 · Dec 15, 2015 · US
Mounting apparatus and mounting method for flip chip bonding semiconductor chips using two-step pressing process
US-9209051-B2 · Dec 8, 2015 · US
LED light source and method of manufacturing the same
US-9207491-B2 · Dec 8, 2015 · US
Electronic component mounting device
US-9210836-B2 · Dec 8, 2015 · US
Lead frame and a method of manufacturing thereof
US-9202712-B2 · Dec 1, 2015 · US
Image sensor package with trench insulator and fabrication method thereof
US-9190362-B2 · Nov 17, 2015 · US
Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
US-9190390-B2 · Nov 17, 2015 · US
Light-emitting apparatus and method for manufacturing same
US-9175818-B2 · Nov 3, 2015 · US
Packaged semiconductor device having multilevel leadframes configured as modules
US-9177945-B2 · Nov 3, 2015 · US
Semiconductor package and method of fabricating the same
US-9165916-B2 · Oct 20, 2015 · US
Matrix lid heatspreader for flip chip package
US-9159643-B2 · Oct 13, 2015 · US
Wiring board and semiconductor device
US-9155195-B2 · Oct 6, 2015 · US
Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die
US-9153476-B2 · Oct 6, 2015 · US
Coreless integrated circuit packaging system and method of manufacture thereof
US-9142530-B2 · Sep 22, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L24/97?
- CPC H01L24/97 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L24/97 (Electricity)?
- Our database includes 4,706 publications tagged with this CPC code.
- Is patent activity under CPC H01L24/97 growing?
- Publication counts under this code: 305 in 2024 vs 317 in 2025 (latest complete years).