Photosensitive composition, cured film and production process thereof, and electronic part

Patent metadata

Field	Value
Publication number	US-9541827-B2
Application number	US-201414166856-A
Country	US
Kind code	B2
Filing date	Jan 29, 2014
Priority date	Feb 21, 2013
Publication date	Jan 10, 2017
Grant date	Jan 10, 2017

Abstract

It is an object of the present invention to improve the curability of a resin composition and a photosensitive composition suitably employed to form e.g., a surface protecting film and an interlaminar insulating film of e.g., an electronic part, while reducing the internal stress remaining in a substrate when the composition is used to form a cured film on the substrate. The photosensitive composition includes a resin (A) having a phenolic hydroxyl group, a crosslinking agent (B1) having at least two oxazoline groups and a crosslinking agent (B2) having at least two groups represented by —CH 2 OR (wherein R is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an acetyl group) and a photosensitive acid-generating agent (C).

First claim

What is claimed is:

1. A photosensitive composition comprising:
a resin (A) having a phenolic hydroxyl group;
a crosslinking agent (B1) having at least two oxazoline groups;
a crosslinking agent (B2) having at least two groups represented by —CH 2 OR, wherein R is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an acetyl group; and
a photosensitive acid-generating agent (C),
wherein a mass ratio of the crosslinking agent (B1) to the crosslinking agent (B2) (B1:B2) is in the range of 1.5:1 to 3:1, and
wherein the crosslinking agent (B2) comprises at least one selected from a melamine-based crosslinking agent, a guanamine-based crosslinking agent, a phenol compound having a methylol group, a phenol compound having an alkylmethylol group and a phenol compound having an acetoxymethyl group.

2. The photosensitive composition according to claim 1 , wherein the total of the contents of the crosslinking agent (B1) and of the crosslinking agent (B2) is 50 to 100% by mass based on 100% by mass of the whole of a crosslinking agen (B) contained in the composition.

3. The photosensitive composition according to claim 1 , wherein the crosslinking agent (B1) has two to three oxazoline groups.

4. The photosensitive composition according to claim 1 , wherein the photosensitive acid-generating agent (C) comprises a compound having a quinone diazide group.

5. A resin composition comprising:
a resin (A) having a phenolic hydroxyl group;
a crosslinking agent (B1) having at least two oxazoline groups; and
a crosslinking agent (B2) having at least two groups represented by —CH 2 OR, wherein R is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an acetyl group,
wherein a mass ratio of the crosslinking agent (B1) to the crosslinking agent (B2) (B1:B2) is in the range of 1.5:1 to 3:1, and
wherein the crosslinking agent (B2) comprises at least one selected from a melamine-based crosslinking agent, a guanamine-based crosslinking agent, a phenol compound having a methylol group, a phenol compound having an alkylmethylol group and a phenol compound having an acetoxymethyl group.

6. A cured film obtained from the photosensitive composition according to claim 1 .

7. A process for producing a patterned cured film comprising:
applying the photosensitive composition according to claim 1 on a support to form a resin coating film;
exposing the resin coating film;
developing the resin coating film by using an alkaline developing solution to form a pattern; and
heat-curing the pattern to form a patterned cured film.

8. A cured film obtained from the resin composition according to claim 5 .

9. A process for producing a cured film comprising:
applying the resin composition according to claim 5 on a support to form a resin coating film; and
heat-curing the resin coating film to form a cured film.

10. An electronic part comprising the cured film according to claim 6 .

11. An electronic part comprising the cured film according to claim 8 .

12. The photosensitive composition according to claim 1 , further comprising an adhesion assistant.

13. The resin composition according to claim 5 , further comprising an adhesion assistant.

Assignees

• Jsr Corp

Inventors

• Sakurai Tomohiko
• Hanamura Masaaki

Classifications

• G03F7/0381 Primary

  using a combination of a phenolic resin and a polyoxyethylene resin · CPC title

• C09D125/18 Primary

  Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen · CPC title

• G03F7/0236

  Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins · CPC title

• C08F8/12

  Hydrolysis · CPC title

• G03F7/0387

  Polyamides or polyimides · CPC title