Compound, resin and photoresist composition

Patent metadata

Field	Value
Publication number	US-11119408-B2
Application number	US-201715660184-A
Country	US
Kind code	B2
Filing date	Jul 26, 2017
Priority date	Jul 29, 2016
Publication date	Sep 14, 2021
Grant date	Sep 14, 2021

Abstract

A resin comprising a structural unit represented by formula (I0):wherein A1, A2 and A3 each independently represent a C2-C18 divalent hydrocarbon group,R1, R2, R3 and R4 each independently represent a hydrogen atom or a C1-C6 saturated hydrocarbon group,X1 and X2 each independently represent *—O—CO—, —O—CO—O— or —O—, and * represents a binding site to A2 or A3.

First claim

What is claimed is:

1. A photoresist composition which comprises a resin and an acid generator,
wherein the resin comprises a structural unit represented by formula (I0), a structural unit represented by formula (a1-1), a structural unit represented by formula (a1-2), a structural unit represented by formula (a2-1) and a structural unit represented by formula (a3-4):

wherein A 1 , A 2 and A 3 each independently represent a C2-C18 divalent hydrocarbon group, R 1 , R 2 , R 3 and R 4 each independently represent a hydrogen atom or a C1-C6 saturated hydrocarbon group, X 1 and X 2 each independently represent —O—CO—O— or —O—,

wherein, in formulae (a1-1) and (a1-2), L a1 and L a2 each independently represents an oxygen atom or *—O—(CH 2 ) k1 —CO—O— in which * represents a binding site to —CO—, and k1 represents an integer of 1 to 7; R a4 and R a5 each independently represent a hydrogen atom or a methyl group; R a6 and R a7 each independently represent a C1-C8 alkyl group, a C3-C18 alicyclic hydrocarbon group, or a combination of them; m1 represents an integer of 0 to 14; n1 represents an integer of 0 to 10; and n1′ represents 0 to 3,

wherein, in formula (a2-1), R a14 represents a hydrogen atom or a methyl group, R a15 and R a16 each independently represent a hydrogen atom, a methyl group or a hydroxy group, L a3 represents an oxygen atom or *—O—(CH 2 ) k2 —CO—O— in which * represents a binding site to —CO—, and k2 represents an integer of 1 to 7, and o1 represents an integer of 0 to 10, and

wherein, in formula (a3-4), L a7 represents a single bond, *-L a8 -O—, *-L a8 -CO—, *-L a8 -CO—O-L a9 -CO—O—, or *-L a8 -O—CO-L a9 -O—; * represents a binding site to oxygen group, La 8 and L a9 each represent a C1-C6 alkanediyl group, R a25 is in occurrence a carboxyl group, a cyano group or a C1-C4 aliphatic hydrocarbon group, R a24 represents a hydrogen atom, a halogen atom or a C1-C6 alkyl group optionally having a halogen atom, and w represents an integer of 0 to 8, and
wherein the photoresist composition further comprises another resin which comprises a structural unit represented by formula (a4-0) and a structural unit represented by formula (a5-1), no structural unit represented by formula (I0) and no structural unit having an acid-labile group:

wherein, in the formula (a4-0), R 5 represents a hydrogen atom or a methyl group, L 5 represents a single bond or a C1-C4 saturated aliphatic hydrocarbon group, L 3 represents a C1-C8 perfluoroalkanediyl group, or a C3-C12 perfluorocycloalkanediyl group, and R 6 represents a hydrogen atom or a fluorine atom,

wherein, in the formula (a5-1), R 51 represents a hydrogen atom or a methyl group; R 52 represents a C3-C18 alicyclic hydrocarbon group, provided that the alicyclic hydrocarbon group has no substituent on the carbon atom bonded to L 55 ; and L 55 represents a single bond or a C1-C8 alkanediyl group where a methylene group can be replaced by an oxygen atom or carbonyl group.

2. The photoresist composition according to claim 1 , wherein the content of the structural unit represented by formula (I0) is 2% to 10% by mole relative to all of the structural units in the resin.

3. The photoresist composition according to claim 1 , wherein the acid generator comprises a salt represented by formula (B1):

wherein Q 1 and Q 2 each independently represent a fluorine atom or a C1-C6 perfluoroalkyl group, L b1 represents a C1-C24 divalent saturated hydrocarbon group where a methylene group can be replaced by an oxygen atom or a carbonyl group and where a hydrogen atom can be replaced by a fluorine atom or a hydroxy group, Y represents a methyl group where a hydrogen atom can be replaced by a substituent, or a C3-C18 alicyclic hydrocarbon group where a methylene group can be replaced by an oxygen atom, a sulfonyl group or a carbonyl group and where a hydrogen atom can be replaced by a substituent, and Z + represents an organic cation.

4. A process for producing a photoresist pattern comprising the following steps (1) to (5):
(1) a step of applying the photoresist composition according to claim 1 on a substrate,
(2) a step of forming a composition film by drying the composition,
(3) a step of exposing the composition film to radiation,
(4) a step of baking the exposed composition film, and
(5) a step of developing the baked composition film.

Assignees

• Sumitomo Chemical Co

Inventors

• Sakamoto Hiromu
• Ichikawa Koji

Classifications

• G03F7/0046 Primary

  with perfluoro compounds, e.g. for dry lithography (G03F7/0048 takes precedence) · CPC title

• G03F7/325

  Non-aqueous compositions · CPC title

• G03F7/0397

  the macromolecular compound having an alicyclic moiety in a side chain · CPC title

• G03F7/168

  Finishing the coated layer, e.g. drying, baking, soaking · CPC title

• G03F7/0381 Primary

  using a combination of a phenolic resin and a polyoxyethylene resin · CPC title