Method for attachment of an electrode into an inductively-coupled plasma

Patent metadata

Field	Value
Publication number	US-9530625-B2
Application number	US-201514734905-A
Country	US
Kind code	B2
Filing date	Jun 9, 2015
Priority date	Nov 30, 2011
Publication date	Dec 27, 2016
Grant date	Dec 27, 2016

Abstract

An inductively coupled plasma charged particle source for focused ion beam systems includes a plasma reaction chamber with a removably attached source electrode. A fastening mechanism connects the source electrode with the plasma reaction chamber and allows for a heat-conductive, vacuum seal to form. With a removable source electrode, improved serviceability and reuse of the plasma source tube are now possible.

First claim

We claim as follows:

1. A method for removable attachment of an electrode to a plasma source, comprising:
providing a plasma source having a reaction chamber, said reaction chamber having a multilayer metal interface layer on a portion of the reaction chamber to which a source electrode or a component to which the source electrode is attached is mounted; and
removably attaching the source electrode to the plasma source, the interface layer providing a thermally conductive, vacuum sealable joint between the reaction chamber and the source electrode or a component to which the source electrode is attached.

2. The method of claim 1 in which providing a plasma source having a reaction chamber, said reaction chamber having an interface layer includes providing a mounting ring attached to the interface layer and in which removably attaching the source electrode to the plasma source includes removable attaching the source electrode to the mounting ring.

3. The method of claim 2 further comprising removing the source electrode from the mounting ring and attaching a second source electrode to the mounting ring.

4. The method of claim 2 in which removably attaching the source electrode to the mounting ring includes using fasteners to removably attach the source electrode to the mounting ring.

5. The method of claim 2 in which removably attaching the source electrode to the mounting ring includes press fitting the source electrode to the mounting ring.

6. The method of claim 2 in which the mounting ring is attached to the interface layer by brazing.

7. The method of claim 1 wherein the multilayer metal interface layer comprises molybdenum, manganese, nickel, indium, aluminum, silver, or gold.

8. The method of claim 1 in which a first layer of the multilayer metal layer comprises a material that bonds to the reaction chamber and a second layer of the multilayer metal layer comprises a material that bonds to a mounting ring to which the source electrode is attached.

9. A method for removably attaching an electrode to a plasma source comprising:
providing a plasma source having a reaction chamber;
providing an interface layer to the reaction chamber;
affixing a mounting ring to the interface layer; and
removably attaching a source electrode to the mounting ring, the combination of the interface layer, mounting ring and source electrode forming a heat conductive seal between the reaction chamber and the source electrode.

10. The method of claim 9 , in which attaching an interface layer to the reaction chamber comprises attaching a thin layer of metal to the reaction chamber.

11. The method of claim 10 , in which attaching a thin layer of metal further comprises attaching a thin layer of one or more of: molybdenum, manganese, nickel, indium, aluminum, silver, or gold.

12. The method of claim 9 , in which the mounting ring and the source electrode comprise a metal that is resistant to the plasma environment and has a thermal coefficient of expansion that is similar to that of the reaction chamber over the range of temperatures endured during manufacture and operation of the plasma source.

13. The method of claim 12 , in which the source electrode comprises one or more of: molybdenum, nickel, or cobalt.

14. The method of claim 9 , in which affixing a mounting ring to the interface layer further comprises affixing the mounting ring to the interface layer by brazing.

15. A method for removably attaching an electrode to a plasma source, comprising:
providing a plasma source having a reaction chamber, said reaction chamber having a portion for attaching a source electrode;
removably attaching a source electrode to the chamber; and
using a metal interface layer on the reaction chamber to provide a heat conductive, vacuum sealed joint between the reaction chamber and the source electrode or between the reaction chamber and a component to which the source electrode is mounted.

16. The method of claim 15 , wherein using a metal interface layer further comprises one or more of: molybdenum, manganese, nickel, indium, aluminum, silver, or gold.

Assignees

• Fei Co

Inventors

• Kellogg Sean
• Graupera Anthony
• Parker William N
• Wells Andrew B
• Utlaut Mark W
• Skoczylas Walter
• Schwind Gregory A
• Smith Noel
• Zhang Shouyin

Classifications

• H01J37/32605 Primary

  Removable or replaceable electrodes or electrode systems · CPC title

• H01J37/08

  Ion sources; Ion guns · CPC title

• H01J27/16

  using high-frequency excitation, e.g. microwave excitation · CPC title

• H01J2237/032

  Mounting or supporting · CPC title

• H01J9/02

  Manufacture of electrodes or electrode systems · CPC title