Flexible computing fabric

Patent metadata

Field	Value
Publication number	US-9526285-B2
Application number	US-201213717909-A
Country	US
Kind code	B2
Filing date	Dec 18, 2012
Priority date	Dec 18, 2012
Publication date	Dec 27, 2016
Grant date	Dec 27, 2016

Abstract

A flexible computing fabric and a method of forming thereof. The flexible computing fabric includes an electronic substrate including one or more channels and including at least two ends. At least one computational element is mounted on the electronic substrate between the two ends and at least one functional element is mounted on the electronic substrate between the two ends. The channels form an interconnect between the elements. In addition, the electronic substrate is flexible and exhibits a flexural modulus in the range of 0.1 GPa to 30 GPa.

First claim

What is claimed is:

1. A flexible computing fabric, comprising:
an electronic substrate including one or more channels, wherein said electronic substrate includes at least two ends;
at least one computational element mounted on a surface of said one or more channels of said electronic substrate between said two ends, and at least one functional element mounted on said surface of said one or more channels of said electronic substrate between said two ends, wherein said one or more channels form an interconnect between said elements;
wherein said electronic substrate is flexible and exhibits a flexural modulus in the range of 0.1 GPa to 30 GPa.

2. The flexible computing fabric of claim 1 , further comprising a memory element mounted to said electronic substrate.

3. The flexible computing fabric of claim 1 , further comprising a connector mounted to said electronic substrate configured to join at least one of said channels to an external component.

4. The flexible computing fabric of claim 3 , wherein said external component comprises a power supply.

5. The flexible computing fabric of claim 1 , further comprising:
more than one electronic substrate;
at least one port mounted to each electronic substrate; and
a junction cable connecting at least two of said ports.

6. The flexible computing fabric of claim 5 , wherein at least one of said elements is mounted to at least two of said substrates.

7. The flexible computing fabric of claim 1 , wherein one of said channels is an optical channel.

8. The flexible computing fabric of claim 1 , wherein one of said channels is an electrical channel.

9. The flexible computing fabric of claim 1 , wherein said electronic substrate includes a coating having a plurality of holes defined therein where said substrates are mounted.

10. The flexible computing fabric of claim 1 , further comprising a bonding layer disposed between said elements and said electronic substrate.

11. The flexible computing fabric of claim 10 , wherein said bonding layer is an anisotropic conductive film.

12. The flexible computing fabric of claim 10 , further comprising one or more interstices between said electronic substrate and an underfill located within said interstices.

13. The flexible computing fabric of claim 1 , wherein said electronic substrate is mounted to a fabric.

14. The flexible computing fabric of claim 1 , wherein said electronic substrate is mounted to an accessory.

15. The flexible computing fabric of claim 1 , wherein said computational element is configured to send a query said functional element and said functional element is configured to provide an address code to said computational element.

16. A garment, comprising:
a garment substrate; and
a flexible computing fabric mounted on said garment substrate, wherein said flexible computing fabric includes an electronic substrate including one or more channels and includes at least two ends, at least one computational element mounted on a surface of said one or more channels of said electronic substrate between said two ends and at least one functional element mounted on said surface of said one or more channels of said electronic substrate between said two ends, wherein said one or more channels form interconnects between said elements, and wherein said electronic substrate is flexible and exhibits a flexural modulus in the range of 0.1 GPa to 30 GPa.

17. The garment of claim 16 , wherein said garment substrate is a fabric.

18. The garment of claim 16 , wherein said flexible computing fabric further comprises tabs and said flexible computing fabric is mounted on said garment substrate by said tabs.

19. The garment of claim 16 , wherein said garment further comprises a pocket affixed to said garment substrate and said flexible computing fabric is embedded in said pocket.

20. The garment of claim 19 , wherein said flexible computing fabric is mounted at an upper portion of said pocket.

Assignees

• Aleksov Aleksandar
• Mahajan Ravindranath V
• Agraharam Sairam
• Young Ian A
• Johnson John C
• Mallik Debendra
• Guzek John S
• Intel Corp

Inventors

• Aleksov Aleksandar
• Mahajan Ravindranath V
• Agraharam Sairam
• Young Ian A
• Johnson John C
• Mallik Debendra
• Guzek John S

Classifications

• H05K3/323

  by applying an anisotropic conductive adhesive layer over an array of pads · CPC title

• Y10T29/4913

  Assembling to base an electrical component, e.g., capacitor, etc. · CPC title

• H05K1/188

  manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component · CPC title

• A41D31/00 Primary

  Materials specially adapted for outerwear · CPC title

• H05K3/3436

  having an array of bottom contacts, e.g. pad grid array or ball grid array components · CPC title