Distributed semiconductor die and package architecture
US-10685947-B2 · Jun 16, 2020 · US
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Mahajan Ravindranath V patents
Mahajan Ravindranath V holds 4 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 4 |
| Recent patents | 0 |
| First publication | Jan 27, 2015 |
| Latest publication | Jun 16, 2020 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Flexible computing fabric
US-9526285-B2 · Dec 27, 2016 · US
Electromagnetic interference shield for semiconductor chip packages
US-9368455-B2 · Jun 14, 2016 · US
Magnetic intermetallic compound interconnect
US-8939347-B2 · Jan 27, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Distributed semiconductor die and package architecture
US-10685947-B2 · Jun 16, 2020 · US
Flexible computing fabric
US-9526285-B2 · Dec 27, 2016 · US
Electromagnetic interference shield for semiconductor chip packages
US-9368455-B2 · Jun 14, 2016 · US
Magnetic intermetallic compound interconnect
US-8939347-B2 · Jan 27, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W90/724 | 2 |
| H10W72/241 | 2 |
| H10W74/01 | 2 |
| H01L24/16 | 2 |
| H01L2224/16225 | 2 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 4 |
| Human Necessities | 1 |
| Operations & Transport | 1 |
| Cross-Sectional Technologies | 1 |