Apparatus for cutting transmission electron microscope micro-grids

Patent metadata

Field	Value
Publication number	US-9522823-B2
Application number	US-201213729425-A
Country	US
Kind code	B2
Filing date	Dec 28, 2012
Priority date	Apr 3, 2012
Publication date	Dec 20, 2016
Grant date	Dec 20, 2016

Abstract

An apparatus for cutting micro-grids from a metal substrate is provided. The apparatus includes a support and a cutting module. The support includes a supporting surface, the support is configured to support a micro-grid and the metal substrate. The cutting module includes a fixing element, a spring and a cutting structure. The fixing structure and the spring are located in the cutting structure. The fixing element is configured to fix the micro-grid on the supporting surface. The cutting structure is configured to cut the micro-grid from the metal substrate.

First claim

What is claimed is:

1. An apparatus for cutting micro-grids from a metal substrate comprising:
a support comprising a cylindrical holder configured to support a micro-grid and the metal substrate; wherein the cylindrical holder has a top surface, two grooves located on the top surface of the cylindrical holder, and the two grooves are located opposite each other; and
a cutting module comprising:
a cutting structure defining a through hole having a first end and a second end opposite to the first end, an inner diameter of the through hole is greater than an outer diameter of the cylindrical holder;
a screw nut engaged with the first end of the through hole, the screw nut closing the through hole;
a spring located in the through hole; and
a fixing element comprising a head received in the through hole and a column extending from the second end of the through hole and out of the through hole, the column defines a cylindrical hole, and the cylindrical hole is enclosed on all sides except for one;
wherein the spring is between the head and the screw nut.

2. The apparatus of claim 1 , wherein the cylindrical holder is fixed relative to the support.

3. The apparatus of claim 1 , wherein the cylindrical holder is fixed relative to the micro-grid and the metal substrate.

4. The apparatus of claim 1 , wherein the cylindrical holder is a solid structure.

5. The apparatus of claim 1 , wherein the support further comprises a bottom defining a hole, the cylindrical holder is configured to be inserted into the hole and fixed on the bottom.

6. The apparatus of claim 5 , wherein the cylindrical holder defines a planar surface contacting with a side surface of the hole, the cylindrical holder is fixed on the bottom via two screws, and the two screws are inserted into the bottom through two screw threads.

7. The apparatus of claim 1 , wherein the micro-grid comprises a bridge ring and a grid structure located in the bridge ring, and a diameter of the cylindrical hole is greater than a diameter of the grid structure and smaller than a diameter of the micro-grid.

8. The apparatus of claim 1 , wherein a cutout is defined only in a portion of the column away from the through hole.

9. The apparatus of claim 1 , wherein the column and the head are coaxial, and a diameter of the column is smaller than a diameter of the head.

10. The apparatus of claim 1 , wherein the spring comprises a spring first end and a spring second end opposite to the spring first end, the spring first end of the spring contacts with the screw nut, and the spring second end of the spring contacts with the head of the fixing element.

11. The apparatus of claim 1 , wherein the support further comprises a bottom, and the cylindrical holder is secured to the bottom.

12. The apparatus of claim 1 , wherein the spring is located on a surface of the head and abuts the surface of the head, and the head is integrated with the column.

13. An apparatus for cutting micro-grids from a metal substrate comprising:
a support comprising a cylindrical holder configured to support a micro-grid and the metal substrate; wherein the cylindrical holder has a top surface, two grooves located on the top surface of the cylindrical holder, and the two grooves are located opposite each other; and
a cutting module comprising:
a cutting structure defining a through hole having a first end and a second end opposite to the first end, an inner diameter of the through hole is greater than an outer diameter of the cylindrical holder;
a screw nut engaged with the first end of the through hole, the screw nut closing the through hole;
a spring located in the through hole; and
a fixing element comprising a head received in the through hole and a column extending from the second end of the through hole and out of the through hole, the column defines a cylindrical hole; the micro-grid comprises a bridge ring and a grid structure located in the bridge ring, and a diameter of the cylindrical hole is greater than a diameter of the grid structure and smaller than a diameter of the micro-grid; the cylindrical hole is enclosed on all sides except for one, and a cutout is defined in a lateral side of the column and is away from the through hole.

14. The apparatus of claim 13 , wherein the cylindrical holder is fixed relative to the micro-grid and the metal substrate.

15. The apparatus of claim 13 , wherein the cylindrical holder is a solid structure.

16. The apparatus of claim 13 , wherein the support further comprises a bottom defining a hole, the cylindrical holder is configured to be inserted into the hole and fixed on the bottom.

17. The apparatus of claim 16 , wherein the cylindrical holder defines a planar surface contacting with a side surface of the hole, the cylindrical holder is fixed on the bottom via two screws, and the two screws are inserted into the bottom through two screw threads.

18. The apparatus of claim 13 , wherein the column and the head are coaxial, and a diameter of the column is smaller than a diameter of the head.

19. The apparatus of claim 13 , wherein the spring comprises a spring first end and a spring second end opposite to the spring first end, the spring first end of the spring contacts with the screw nut, and the spring second end of the spring contacts with the head of the fixing element.

Assignees

• Univ Tsinghua
• Hon Hai Prec Ind Co Ltd

Inventors

• Feng Chen
• Guo Xue-Wei

Classifications

• B81C1/00436 Primary

  Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate · CPC title

• H01J37/20 Primary

  Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support · CPC title

• Y10T225/393

  Web restrainer · CPC title

• B26F1/02

  Perforating by punching, e.g. with relatively-reciprocating punch and bed · CPC title