Printed circuit board cover

Patent metadata

Field	Value
Publication number	US-9516795-B2
Application number	US-201213558321-A
Country	US
Kind code	B2
Filing date	Jul 25, 2012
Priority date	Jan 10, 2012
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

A sheet metal cover for a printed circuit board (PCB) includes a plurality of legs continuous with a substantially planar elevated section. The legs are attached to the PCB, and electrical connections are provided between the legs and an internal ground plane of the PCB at the attachment locations. The sheet metal cover is thereby grounded, inhibiting the transmission of electromagnetic signals through the sheet metal cover. The elevated section of the sheet metal cover prevents select electronic devices on the PCB from being viewed or probed. Openings through the sheet metal cover allow heat sinks or heat generating electronic devices (e.g., inductors) to be exposed through these openings, thereby facilitating cooling of these elements by airflow. An electrically conductive gasket attached to the underside of the elevated section may contact the heat sinks, further minimizing the radiation of EMI emissions.

First claim

We claim:

1. A system comprising:
a printed circuit board having a first set of one or more electronic devices mounted thereon;
a sheet metal cover that includes a plurality of legs and an elevated section, wherein the plurality of legs and the elevated section are formed from a continuous piece of sheet metal, wherein the plurality of legs are coupled to the printed circuit board, and wherein the elevated section is positioned over the first set of one or more electronic devices when the plurality of legs are coupled to the printed circuit board;
an opening in the elevated section of the sheet metal cover, wherein an element attached to the printed circuit board extends through the opening; and
an electrically conductive gasket that contacts the sheet metal cover and the element that extends through the opening in the elevated section of the sheet metal cover, wherein the gasket extends partially into the opening in the elevated section of the sheet metal cover.

2. The system of claim 1 , further comprising conductive elements that electrically connect the legs of the sheet metal cover to an internal ground plane of the printed circuit board, thereby grounding the sheet metal cover.

3. The system of claim 1 , wherein the element comprises a heat sink.

4. The system of claim 1 , wherein the element comprises an electronic device.

5. The system of claim 4 , wherein the electronic device is an inductor.

6. The system of claim 1 , wherein the gasket is attached to the elevated section of the sheet metal cover.

7. The system of claim 1 , wherein the gasket is attached to the element that extends through the opening in the elevated section of the sheet metal cover.

8. The system of claim 1 , wherein the element that extends through the opening in the elevated section of the sheet metal cover is a heat sink.

9. The system of claim 1 , wherein the electrically conductive gasket is located between the elevated section and the first set of one or more electronic devices mounted on the printed circuit board.

10. The system of claim 1 , wherein the plurality of legs are spaced apart from one another.

11. The system of claim 10 , wherein the legs contact the printed circuit board at discrete locations on the printed circuit board.

12. The system of claim 1 , wherein a gap exists between the elevated section and the electronic devices, thereby allowing an airflow to reach the electronic devices.

Assignees

• Moore Jr Alston C
• Siechen Mark G
• Brocade Comm Systems Inc

Inventors

• Moore Jr Alston C
• Siechen Mark G

Classifications

• H05K7/20

  Modifications to facilitate cooling, ventilating, or heating · CPC title

• H05K9/0028

  with retainers or specific soldering features · CPC title

• H05K9/0026 Primary

  integrally formed from metal sheet · CPC title