Electronic device assembly with compression gasket

Patent metadata

Field	Value
Publication number	US-9411385-B2
Application number	US-201313892571-A
Country	US
Kind code	B2
Filing date	May 13, 2013
Priority date	May 13, 2013
Publication date	Aug 9, 2016
Grant date	Aug 9, 2016

Abstract

An assembly ( 1000 ) includes a substrate ( 1002 ) and a heat emissive electrical component ( 1001 ) disposed on the substrate. A shield ( 1003 ) is disposed on the substrate, thereby enclosing the heat emissive electrical component. A display assembly ( 101 ) is disposed above the shield. A compressible pad ( 1004 ) is disposed between the shield and the display assembly. The compressible pad defines an aperture ( 1005 ) above the heat emissive electrical component. The aperture can have dimensions that are a function of a shield area and a heat emissive electrical component area.

First claim

What is claimed is:

1. An assembly, comprising: a substrate; a heat emissive electrical component disposed on the substrate; a shield disposed on the substrate enclosing the heat emissive electrical component; a display assembly; and a compressible pad disposed between the shield and the display assembly, the compressible pad defining an aperture above the heat emissive electrical component, the aperture having dimensions that are a function of a shield area and a heat emissive electrical component area.

2. The assembly of claim 1 , the aperture having a major aperture dimension greater than 0.9 times a major component dimension.

3. The assembly of claim 2 , the major aperture dimension greater than the major component dimension.

4. The assembly of claim 2 , the major aperture dimension less than 1.2 times the major component dimension.

5. The assembly of claim 4 , the heat emissive electrical component having a power dissipation greater than one watt.

6. The assembly of claim 4 , the heat emissive electrical component having a major dimension greater than ten millimeters.

7. The assembly of claim 2 , a major shield dimension greater than the major aperture dimension.

8. The assembly of claim 7 , the major shield dimension more than one millimeter greater than the major aperture dimension.

9. The assembly of claim 7 , the major shield dimension less than 1.2 times the major component dimension.

10. The assembly of claim 7 , a loading force applied by the compressible pad between the display assembly and the shield a function of a difference between the major shield dimension and the major aperture dimension.

11. The assembly of claim 10 , the loading force further a function of a compression coefficient of the compressible pad.

12. The assembly of claim 1 , further comprising a first housing member and a second housing member disposed opposite the assembly to compress the compressible pad between the shield and the display assembly.

13. The assembly of claim 1 , the compressible pad comprising a reflective layer disposed adjacent to the shield.

14. The assembly of claim 1 , the display assembly comprising an organic light emitting display.

15. An assembly, comprising: a heat dissipation device enclosed by a shield and a circuit board; a device element comprising a display; and a compression gasket disposed between the shield and the device element, the compression gasket defining a chamber axially aligned with the heat dissipation device.

16. The assembly of claim 15 , the chamber being wider along a first dimension than the heat dissipation device and narrower along a second dimension, orthogonal to the first dimension, than the heat dissipation device.

17. The assembly of claim 15 , the chamber having a first perimeter shape, the heat dissipation device having a second perimeter shape, the first perimeter shape and the second perimeter shape being different.

18. The assembly of claim 15 , the chamber having a common dimension with the heat dissipation device and a different dimension, orthogonal to the common dimension, than the heat dissipation device.

19. The assembly of claim 15 , the chamber having a non-rectangular perimeter.

Assignees

• Google Technology Holdings LLC
• Google Technology Holdings LLC

Inventors

• Pierce Amber M
• Bowers Morris B
• Cole Adam R
• Thiruppukuzhi Srikanth V

Classifications

• G06F1/203 Primary

  for portable computers, e.g. for laptops · CPC title

• G06F1/1658

  related to the mounting of internal components, e.g. disc drive or any other functional module · CPC title

• H05K9/0026

  integrally formed from metal sheet · CPC title