Electronic component and board having the same

Patent metadata

Field	Value
Publication number	US-2016234979-A1
Application number	US-201614995084-A
Country	US
Kind code	A1
Filing date	Jan 13, 2016
Priority date	Feb 11, 2015
Publication date	Aug 11, 2016
Grant date	—

Abstract

An electronic component includes a body having a bottom surface provided as amounting surface, a top surface opposing the bottom surface, first and second side surfaces opposing each other in a width direction, and third and fourth end surfaces opposing each other in a length direction, a conductor part disposed therein, first and second external electrodes spaced apart from each other on the bottom surface of the body and connected to the conductor part, and a first insulating coating layer on the top surface of the body and a second insulating coating layer on the bottom surface of the body.

First claim

What is claimed is:

1 . An electronic component comprising:
a body having a bottom surface provided as a mounting surface, a top surface opposing the bottom surface, first and second side surfaces opposing each other in a width direction, and third and fourth end surfaces opposing each other in a length direction, and including a conductor part disposed in the body; first and second external electrodes spaced apart from each other on the bottom surface of the body and connected to the conductor part; and a first insulating coating layer on the top surface of the body and a second insulating coating layer on the bottom surface of the body.

2 . The electronic component of claim 1 , wherein the second insulating coating layer is disposed between the first and second external electrodes.

3 . The electronic component of claim 1 , wherein the first and second external electrodes extend from the bottom surface of the body to the first and second side surfaces of the body.

4 . The electronic component of claim 1 , wherein the first external electrode extends from the bottom surface of the body to the third end surface of the body, and the second external electrode extend from the bottom surface of the body to the fourth end surface of the body.

5 . The electronic component of claim 4 , wherein a 1 /t 1 satisfies 0.1≦a 1 /t 1 ≦1, in which t 1 is a thickness of the electronic component and a 1 is a width of an extended portion of each of the first and second external electrodes on the first or second side surface or the third or fourth end surface of the body.

6 . The electronic component of claim 1 , wherein the first and second external electrodes comprise plating layers.

7 . The electronic component of claim 1 , wherein the conductor part comprises a coil having a coil shape.

8 . The electronic component of claim 1 , wherein the conductor part comprises first and second internal electrodes overlapping each other to form capacitance.

9 . The electronic component of claim 1 , wherein the first insulating coating layer extends from the top surface of the body to the first and second side surfaces and the third and fourth end surfaces of the body.

10 . The electronic component of claim 1 , wherein the second insulating coating layer extends from the bottom surface of the body to the first and second side surfaces of the body.

11 . The electronic component of claim 1 , wherein b 1 /t 1 satisfies 0.1≦b 1 /t 1 ≦1,in which t 1 is a thickness of the electronic component and b 1 is a width of an extended portion of the first insulating coating layer on the first or second side surface, or the third or fourth end surface of the body.

12 . The electronic component of claim 1 , wherein b 2 /t 1 satisfies 0.1≦b 2 /t 1 ≦1, in which t 1 is a thickness of the electronic component and b 2 is a width of an extended portion of the second insulating coating layer on the first or second side surface of the body.

13 . The electronic component of claim 1 , wherein a ratio of an area of the first insulating coating layer covering the top surface of the body to an area of the top surface of the body is 0.1 to 1.

14 . The electronic component of claim 1 , wherein a ratio of an area of the second insulating coating layer covering the bottom surface of the body to an area of a portion of the top surface of the body on which the external electrodes are not formed is 0.1 to 1.

15 . A board having an electronic component, the board comprising:
a printed circuit board on which first and second electrode pads are provided; an electronic component mounted on the printed circuit board and including a body having a bottom surface provided as amounting surface, a top surface opposing the bottom surface, first and second side surfaces opposing each other in a width direction, and third and fourth end surfaces opposing each other in a length direction and including a conductor part disposed in the body, first and second external electrodes spaced apart from each other on the bottom surface of the body and connected to the conductor part, and a first insulating coating layer on the top surface of the body and a second insulating coating layer on the bottom surface of the body; and solders connecting the first and second external electrodes to the first and second electrode pads.

16 . The board of claim 15 , further comprising a metal case disposed on the printed circuit board to cover the electronic component.

17 . The board of claim 15 , wherein the second insulating coating layer is disposed between the first and second external electrodes.

18 . The board of claim 15 , wherein the first and second external electrodes comprise plating layers.

Assignees

• Samsung Electro Mech

Inventors

• Lee Jae Wook
• Choi Jae Yeol
• Oh Sung Kwon
• Choi Min Sung
• Kim Ji Hea

Classifications

• H01G4/236

  leading through the housing, i.e. lead-through · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title

• H05K1/181

  associated with surface mounted components · CPC title