Printed circuit board with fluid flow channels

Patent metadata

Field	Value
Publication number	US-9480149-B2
Application number	US-201414230843-A
Country	US
Kind code	B2
Filing date	Mar 31, 2014
Priority date	Dec 10, 2013
Publication date	Oct 25, 2016
Grant date	Oct 25, 2016

Abstract

An embodiment of an electronic system includes a printed circuit board (PCB) including fluid flow channel extending through the PCB. In addition, the electronic system includes an electronic component including a bottom surface and positioned on the PCB over the fluid flow channel to thereby expose the bottom surface of the electronic component to fluid flow through the fluid flow channel.

First claim

What is claimed is:

1. An electronic system, comprising:
a printed circuit board (PCB) including an aperture extending through the PCB; and
an electronic component including a bottom surface and positioned on the PCB over the aperture to thereby expose the bottom surface of the electronic component to fluid flow through the aperture;
wherein at least 50% of the bottom surface of the electronic component is exposed through the aperture; and
wherein the aperture is formed at a peripheral edge of the PCB.

2. The electronic system of claim 1 , wherein the PCB includes a plurality of apertures and the electronic component comprises a plurality of electronic components, each electronic component including a bottom surface that, when positioned over a corresponding aperture, is exposed to fluid flow through the corresponding aperture.

3. The electronic system of claim 2 , wherein the plurality of apertures are arranged parallel to one another.

4. The electronic system of claim 1 , wherein the aperture has a shape that is rectangular.

5. The electronic system of claim 1 , wherein the aperture has a shape that is substantially similar to the shape of the bottom surface of the electronic component.

6. The electronic system of claim 1 , wherein the electronic component is an optical module.

7. The electronic system of claim 1 , further comprising an electromagnetic interference (EMI) cage coupled to the PCB and including an inner region that is configured to receive the electronic component to at least partially shield the electronic component from electromagnetic interference.

8. An electronic apparatus, comprising:
a substrate including:
a first surface;
a second surface opposite the first surface; and

a plurality of apertures each extending from the first surface to the second surface; and
a plurality of electronic components each having an engagement surface coupled to the first surface of the substrate at the engagement surface,
wherein each of the plurality of electronic components is positioned on the first surface of substrate such that the engagement surface is positioned over one of the plurality of apertures to allow a fluid to flow through the plurality of apertures from the second surface toward the engagement surface of each of the plurality of electronic components;
wherein one or more of the plurality of apertures is formed at a peripheral edge of the substrate.

9. The electronic system of claim 8 , wherein one or more of the plurality of apertures has a shape that is rectangular.

10. The electronic system of claim 8 , wherein one or more of the plurality of apertures has a shape that is one of square, circular, polygonal, hexagonal, octagonal, triangular, zigzag, and oval.

11. The electronic system of claim 8 , wherein one or more of the plurality of apertures has a shape that is substantially similar to the shape of the engagement surface of the electronic component.

12. The electronic system of claim 8 , wherein one or more of the plurality of electronic components is an optical module.

13. The electronic system of claim 10 , further comprising a plurality of electromagnetic interference (EMI) cages, wherein each of the plurality of EMI cages is disposed on the first surface of the substrate and includes an inner region configured to receive one of the plurality of electronic components therein to at least partially shield the received electronic component from electromagnetic interference.

14. A printed circuit board, comprising:
a substrate including a first surface and a second surface opposite the first surface, and an aperture extending from the first surface to the second surface;
wherein the substrate is configured to have an electronic component mounted to the first surface such that a bottom surface of the electronic component is substantially disposed over the aperture;
wherein the aperture is formed at a peripheral edge of the substrate.

15. The printed circuit board of claim 14 , wherein the aperture has a shape that is substantially similar to a shape of a bottom surface of the electronic component.

16. The electronic system of claim 1 , wherein at least 80% of the bottom surface of the electronic component is exposed through the aperture.

17. The electronic system of claim 1 , wherein substantially all of the bottom surface of the electronic component is exposed through the aperture.

Assignees

• Brocade Comm Systems Inc

Inventors

• Mokhtarzad Shahriar

Classifications

• H05K9/0024

  Shield cases mounted on a PCB, e.g. cans or caps or conformal shields · CPC title

• H05K2201/10515

  Stacked components · CPC title

• H05K2201/09072

  Hole or recess under component or special relationship between hole and component · CPC title

• H05K2201/064

  Fluid cooling, e.g. by integral pipes · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title