Power resistor with integrated heat spreader

Patent metadata

Field	Value
Publication number	US-9502161-B2
Application number	US-201414473118-A
Country	US
Kind code	B2
Filing date	Aug 29, 2014
Priority date	Dec 21, 2012
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

A resistor and an integrated heat spreader are provided. A resistive element having a first surface is in contact with electrically conducting terminals. A heat spreader is provided having at least a portion in thermally conductive contact with at least a portion of the first surface of the resistive element. The heat spreader comprising a thermally conducting and electrically insulating material, and has terminations, each termination adjacent to one of the electrically conducting terminals. Each termination is in thermally conducting contact with the adjacent electrically conducting terminal. A method of fabricating a resistor and an integrated heat spreader is also provided.

First claim

What is claimed is:

1. A resistor and an integrated heat spreader, comprising:
a resistive element having a first surface, the resistive element comprising electrically conducting terminals; and
a heat spreader having at least a portion in thermally conductive contact with at least a portion of the first surface of the resistive element, the heat spreader comprising a thermally conducting and electrically insulating material, the heat spreader comprising terminations formed separately from the electrically conducing terminals, each termination adjacent to one of the electrically conducting terminals;
wherein each termination is in thermally conducting contact with the adjacent electrically conducting terminal.

2. The resistor and integrated heat spreader of claim 1 , wherein the heat spreader comprises a heat sink.

3. The resistor and integrated heat spreader of claim 2 , wherein at least a portion of the heat sink is bonded to at least a portion of the first surface of the resistor.

4. The resistor and integrated heat spreader of claim 3 , wherein the at least a portion of the heat sink is bonded to at least a portion of the first surface of the resistor with an adhesive, and, wherein the adhesive does not extend over the terminals and does not extend over the terminations.

5. The resistor and integrated heat spreader of claim 2 , wherein the heat sink comprises an edge surface, and wherein the terminations are situated only on the edge surface of the heat sink.

6. The resistor and integrated heat spreader of claim 2 , wherein the heat sink comprises a front surface that is in thermally conductive contact with at least a portion of the resistive element, and wherein the terminations are situated only on the front surface of the heat sink.

7. The resistor and integrated heat spreader of claim 2 , wherein the heat sink comprises an edge surface and a back surface on an opposite side of a front surface, and wherein the terminations wrap around onto at least one of the edge surface of the heat sink and the back surface of the heat sink.

8. The resistor and integrated heat spreader of claim 1 , further comprising a plated metallic layer on surfaces of the terminals and the terminations.

9. The resistor and integrated heat spreader of claim 3 , wherein the at least a portion of the heat sink is bonded to at least a portion of the first surface of the resistor with an adhesive, and wherein the adhesive is a thermally conductive and electrically insulating adhesive.

10. The resistor and integrated heat spreader of claim 1 , wherein the resistive element is a metal strip resistive element.

11. A method of fabricating a resistor having electrically conducting terminals and an integrated heat spreader having terminations, the electrically conducting terminals being formed separately from the terminations, comprising:
forming a thermally conductive contacting between at least a portion of the resistor and at least a portion of the heat spreader; and
forming a thermally conducting contact between each electrically conducting terminal and an adjacent termination.

12. The method of claim 11 , further comprising bonding each of the electrically conducting terminals to an adjacent termination to form thermally and electrically conductive contact between the electrically conducting terminals and the terminations.

13. The method of claim 11 , wherein the heat spreader comprises a heat sink, and further comprising bonding at least a portion of the resistive element to at least a portion of the heat sink.

14. The method of claim 13 , wherein at least a portion of the heat sink is bonded to at least a portion of the first surface of the resistor by a thermally conducting and electrically insulating adhesive.

15. The method of claim 13 , wherein the heat sink comprises edge surfaces, and further comprising forming the terminations only on the edge surfaces of the heat sink.

16. The method of claim 13 , wherein the heat sink comprises a front surface, and further comprising forming the terminations only on the front surface of the heat sink.

17. The method of claim 13 , wherein the heat sink comprises an edge surface and a back surface on an opposite side of a front surface, and wherein the terminations wrap around an onto at least one of the edge surface of the heat sink and the back surface of the heat sink.

18. The method of claim 11 , further comprising plating a metallic layer on surfaces of the terminals and the terminations.

19. The method of claim 13 , wherein at least a portion of the heat sink and at least a portion of the resistive element are bonded by a thermally conductive and electrically insulating adhesive.

20. The method of claim 11 , wherein the resistive element is a metal strip resistive element.

Assignees

• Vishay Dale Electronics Llc

Inventors

• Smith Clark
• Wyatt Todd

Classifications

• Y10T29/49101

  Applying terminal · CPC title

• Y10T29/49082

  Resistor making · CPC title

• H01C7/003

  Thick film resistors · CPC title

• H01C1/148

  the terminals embracing or surrounding the resistive element (H01C1/142 takes precedence) · CPC title

• H01C1/14

  Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors · CPC title