Resistor and method for manufacturing resistor

Patent metadata

Field	Value
Publication number	US-10037837-B2
Application number	US-201515110096-A
Country	US
Kind code	B2
Filing date	Jan 7, 2015
Priority date	Jan 8, 2014
Publication date	Jul 31, 2018
Grant date	Jul 31, 2018

Abstract

In this resistor, a heat sink (Al member) ( 23 ) and the other surface ( 11 b ) of a ceramic substrate ( 11 ) are joined together using an Al—Si-based brazing filler material. The Al—Si-based brazing filler material has a melting point in a range of approximately 600° C. to 700° C. When the heat sink ( 23 ) and the ceramic substrate ( 11 ) are joined together using the Al—Si-based brazing filler material, it is possible to prevent the derogation of the heat resistance and thermal deterioration during joining at the same time.

First claim

The invention claimed is:

1. A resistor comprising:
a chip resistive element formed on one surface of a ceramic substrate, wherein the chip resistive element includes a resistive element, a first metal electrode, and a second metal electrode;
a first metal terminal and a second metal terminal electrically and respectively connected to the first metal electrode and the second metal electrode; and
an Al member formed on the other surface of the ceramic substrate,
wherein the ceramic substrate and the Al member are joined together using an Al—Si-based brazing filler material,
one surface of the resistive element is in contact with the ceramic substrate,
the first metal electrode and the second metal electrode are formed on other surface of the resistive element,
the first metal electrode and the first metal terminal are respectively joined to a first end and a second end of a first metal member, thereby being electrically connected to each other,
the second metal electrode and the second metal terminal are respectively joined to a first end and a second end of a second metal member, thereby being electrically connected to each other, and
the first metal member and the second metal member have a melting point of 450° C. or higher.

2. The resistor according to claim 1 , wherein the first metal member and the second metal member are an Al wire or Al tape.

3. The resistor according to claim 1 ,
wherein the Al member is a laminate of a buffer layer made of Al having a purity of 99.98% or higher and a heat sink, and the buffer layer and the other surface of the ceramic substrate are joined together using an Al—Si-based brazing filler material.

4. The resistor according to claim 3 , wherein a thickness of the buffer layer is in a range of 0.4 mm to 2.5 mm.

5. The resistor according to claim 3 ,
wherein a thickness of the ceramic substrate is in a range of 0.3 mm to 1.0 mm, and a thickness of the heat sink is in a range of 2.0 mm to 10.0 mm.

6. The resistor according to claim 1 ,
wherein the chip resistive element, the first metal terminal, and the second metal terminal are partially covered with an insulating sealing resin, and the sealing resin is a resin having a thermal expansion coefficient in a range of 8 ppm/° C. to 20 ppm/° C.

7. The resistor according to claim 6 ,
wherein the sealing resin includes 72% to 84% of the SiO 2 filler and 16% to 28% of the epoxy resin.

8. The resistor according to claim 1 ,
wherein the Al member forms a curved surface on a opposite surface which is located opposite to a joint surface between the ceramic substrate and the Al member, the curved surface curving in a direction opposite to the ceramic substrate, and forming the bottom of a curve in a central region of the opposite surface, and
a degree of curving of the opposite surface is in a range of 30 μm/50 mm to 700μm/50 mm.

9. A method for manufacturing a resistor with which the resistor according to claim 1 is manufactured, the method comprising:
a step of disposing an Al—Si-based brazing filler material between the ceramic substrate and the Al member and pressurizing them in a lamination direction under heating, thereby joining the ceramic substrate and the Al member using the Al—Si-based brazing filler material;
a step of positioning the first metal terminal on a surface of the first metal electrode using an adhesive, and positioning the second metal terminal on a surface of the second metal electrode using an adhesive;
a step of respectively bringing the first metal terminal and the first metal electrode into contact with the first end and the second end of the first metal member and applying ultrasonic waves to them, thereby respectively joining the first metal electrode and the first metal terminal to the first end and the second end of the first metal member, and
a step of respectively bringing the second metal terminal and the second metal electrode into contact with the first end and the second end of the second metal member and applying ultrasonic waves to them, thereby respectively joining the second metal electrode and the second metal terminal to the first end and the second end of the second metal member.

10. The method for manufacturing a resistor according to claim 8 with which the resistor according to claim 6 is manufactured, the method comprising:
a step of disposing a framework so as to surround a periphery of the chip resistive element; and
a step of filling an inside of the framework with the softened sealing resin.

11. The resistor according to claim 1 ,
wherein the first metal electrode and the first metal terminal are respectively ultrasonic-joined to the first end and the second end of the first metal member,
the second metal electrode and the second metal terminal are respectively ultrasonic-joined to the first end and the second end of the second metal member.

Assignees

• Mitsubishi Materials Corp

Inventors

• Nagase Toshiyuki
• Ishizuka Hiroya

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07651

  characterised by changes in properties of the strap connectors during connecting · CPC title

• H10W72/60

  Strap connectors, e.g. thick copper clips for grounding of power devices · CPC title

• H01C17/006

  adapted for manufacturing resistor chips · CPC title

• H01C17/281

  by thick film techniques · CPC title