Electronics tester with hot fluid thermal control

Patent metadata

Field	Value
Publication number	US-9500702-B2
Application number	US-201615015051-A
Country	US
Kind code	B2
Filing date	Feb 3, 2016
Priority date	Apr 5, 2007
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

The invention relates to a tester apparatus of the kind including a portable supporting structure for removably holding and testing a substrate carrying a microelectronic circuit. An interface on the stationary structure is connected to the first interface when the portable structure is held by the stationary structure and is disconnected from the first interface when the portable supporting structure is removed from the stationary structure. An electrical tester is connected through the interfaces so that signals may be transmitted between the electrical tester and the microelectronic circuit to test the microelectronic circuit.

First claim

What is claimed:

1. A tester apparatus, comprising:
a portable supporting structure for holding a substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit;
a plurality of contacts on the portable supporting structure, the contacts matching the terminals for making contact to the terminals;
a first interface on the portable supporting structure and connected to the contacts;
a stationary structure, the portable supporting structure being receivable to be held by the stationary structure and being removable from the stationary structure;
a second interface on the stationary structure, the second interface being connected to the first interface when the portable structure is held by the stationary structure and being disconnected from the first interface when the portable supporting structure is removed from the stationary structure;
a heater, heat being transferred to a fluid by the heater when the fluid is outside the thermal control passage;
a thermal chuck on the stationary structure, the thermal chuck having a thermal control passage with an inlet, an outlet and at least one section between the inlet and the outlet for the fluid to flow from the inlet to the outlet, heat transferring through the thermal chuck between the substrate and the fluid in the thermal control passage; and
an electrical tester connected through the second interface, the first interface, and the contacts to the terminals so that signals are transmitted between the electrical tester and the microelectronic circuit to test the microelectronic circuit.

2. The tester apparatus of claim 1 , wherein the thermal control passage has first, second, and third sections in series after one another along a path of the fluid and the third section is located between the first and second sections in cross-sectional plan view.

3. The tester apparatus of claim 2 , wherein the thermal control passage has a fourth section in series after the third section along the path of the fluid, the fourth section being located between the second and third sections.

4. The tester apparatus of claim 3 , wherein the thermal control passage has a fourth section in series after the third section along the path of the fluid, the fourth section being located between the first and second sections.

5. The tester apparatus of claim 2 , wherein the first, second, and third sections are sections of a first spiral.

6. The tester apparatus of claim 2 , wherein the first and second sections are sections of a first spiral and the third section is a section of a second spiral that is not located on the first spiral.

7. The tester apparatus of claim 1 , wherein the heater is an electric heater.

8. The tester apparatus of claim 1 , wherein the fluid is recirculated.

9. A method of testing a microelectronic circuit held by a substrate, comprising:
holding the substrate in a portable supporting structure having contacts against terminals of the substrate connected to the microelectronic circuit;
receiving the portable supporting structure by a stationary structure with a first interface on the portable supporting structure connected to a second interface on the stationary structure;
passing a fluid from a fluid inlet to a fluid outlet through at least one section of a thermal control passage in a thermal chuck on the stationary structure, wherein the fluid has a temperature above 21 degrees Celsius when the fluid enters the fluid inlet;
transferring heat between the fluid in the thermal control passage and the substrate to control a temperature of the substrate; and
transmitting signals between an electrical tester and the microelectronic circuit through the terminals, contacts, and first and second interfaces to test the microelectronic circuit.

10. The method of claim 9 , wherein the fluid has a temperature above 21 degrees Celsius when the fluid enters the fluid inlet.

11. The method of claim 10 , wherein heat is transferred from the substrate to the fluid that enters the fluid inlet at above 21 degrees Celsius.

12. The method of claim 11 , wherein heat is first transferred from the fluid to the substrate after the fluid enters the fluid inlet at above 21 degrees Celsius.

13. The method of claim 10 , wherein the fluid has a temperature above 100 degrees Celsius when the fluid enters the fluid inlet.

Assignees

• Aehr Test Systems

Inventors

• Steps Steven C
• Lindsey Scott E
• Deboe Kenneth W
• Richmond Ii Donald P
• Calderon Alberto

Classifications

• G01R31/2865

  Holding devices, e.g. chucks; Handlers or transport devices (having contacts G01R31/2863) · CPC title

• G01R31/2875 Primary

  related to heating · CPC title

• G01R31/2879

  related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads · CPC title

• G01R1/0491

  for testing integrated circuits on wafers, e.g. wafer-level test cartridge · CPC title

• G01R31/2856

  Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM] · CPC title