Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit Device
US-2024238914-A1 · Jul 18, 2024 · US
Composition and methods of forming solder bump and flip chip using the same
US9155236B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9155236-B2 |
| Application number | US-201414325517-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 8, 2014 |
| Priority date | Jul 10, 2008 |
| Publication date | Oct 6, 2015 |
| Grant date | Oct 6, 2015 |
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Abstract
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Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
First claim
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What is claimed is: 1. A method of forming a flip chip, comprising: preparing a first substrate on which first conductive patterns are formed and a second substrate on which second conductive patterns are formed; providing a first composition on the first substrate to cover the first conductive patterns, the first composition comprising a low melting point solder, a thermal-curable polymer resin, and a curing agent of an anhydride family material; forming first solder patterns…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9155236B2 cover?
- Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent,…
- Who is the assignee on this patent?
- Korea Electronics Telecomm
- What technology area does this patent fall under?
- Primary CPC classification B23K3/0623. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Oct 06 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).