De-bonding and cleaning process and system

Patent metadata

Field	Value
Publication number	US-9475272-B2
Application number	US-201414511010-A
Country	US
Kind code	B2
Filing date	Oct 9, 2014
Priority date	Oct 9, 2014
Publication date	Oct 25, 2016
Grant date	Oct 25, 2016

Abstract

Methods and tools for de-bonding and cleaning substrates are disclosed. A method includes de-bonding a surface of a first substrate from a second substrate, and after de-bonding, cleaning the surface of the first substrate. The cleaning comprises physically contacting a cleaning mechanism to the surface of the first substrate. A tool includes a de-bonding module and a cleaning module. The de-bonding module comprises a first chuck, a radiation source configured to emit radiation toward the first chuck, and a first robot arm having a vacuum system. The vacuum system is configured to secure and remove a substrate from the first chuck. The cleaning module comprises a second chuck, a spray nozzle configured to spray a fluid toward the second chuck, and a second robot arm having a cleaning device configured to physically contact the cleaning device to a substrate on the second chuck.

First claim

What is claimed is:

1. A method comprising:
de-bonding a surface of a first substrate from a second substrate, the first substrate being attached to a tape, the tape being attached to a frame, the frame being on a same side of the tape as the first substrate;
after de-bonding the first substrate, placing a cover ring over a portion of the tape and over an upper surface of the frame, the cover ring encircling the first substrate; and
after de-bonding, cleaning the surface of the first substrate, the cleaning comprising physically contacting a cleaning mechanism to the surface of the first substrate, wherein during the cleaning the surface, the cover ring covers the tape.

2. The method of claim 1 , wherein the de-bonding comprises decomposing a release coating on the surface of the first substrate and between the first substrate and the second substrate, a residue of the release coating remaining on the surface after the de-bonding, the cleaning mechanism physically removing the residue during the cleaning the surface.

3. The method of claim 1 , wherein the cleaning mechanism comprises a sponge.

4. The method of claim 1 , wherein the cleaning mechanism comprises a brush.

5. The method of claim 1 , wherein the cleaning the surface of the first substrate comprises supplying a fluid to the surface of the first substrate.

6. The method of claim 5 , wherein the fluid comprises deionized water.

7. The method of claim 5 , wherein the fluid comprises isopropyl alcohol.

8. The method of claim 1 , further comprising clamping the cover ring to the frame using a clamp, the clamp extending over a portion of the cover ring.

9. A method comprising:
providing a package substrate bonded to a carrier substrate by a release coating, the release coating being on a surface of the package substrate;
placing the package substrate on a tape, the package substrate being interposed between the carrier substrate and the tape, the tape being held by a frame;
decomposing the release coating and separating the carrier substrate from the package substrate;
after separating the carrier substrate from the package substrate, placing the package substrate in a cleaning module;
after placing the package substrate in the cleaning module, placing a cover ring over a portion of the tape adjacent the package substrate, the cover ring extending over at least a portion of an upper surface of the frame; and
cleaning the surface of the package substrate, the cleaning including supplying a fluid to the surface of the package substrate and contacting the surface of the package substrate with a cleaning mechanism to physically remove residue of the release coating from the surface of the package substrate.

10. The method of claim 9 , wherein the fluid comprises deionized water, isopropyl alcohol, or a combination thereof.

11. The method of claim 9 , wherein the cleaning mechanism comprises a brush, a sponge, or a combination thereof.

12. The method of claim 9 , wherein during the cleaning, the cover ring covers portions of the tape that the package substrate is not on during the cleaning.

13. The method of claim 9 , wherein the decomposing the release coating comprises using a laser light scan.

14. A tool comprising:
a de-bonding module comprising:
a first chuck,
a radiation source configured to emit radiation toward the first chuck, and
a first robot arm having a vacuum system, the vacuum system configured to secure and remove a substrate from the first chuck; and

a cleaning module comprising:
a second chuck,
a frame attached to the second chuck,
a cover ring attached to the frame, the cover ring being configured to encircle the substrate on the second chuck and to cover at least a portion of the second chuck and to cover an upper surface of the frame,
a spray nozzle configured to spray a fluid toward the second chuck, and
a second robot arm having a cleaning device configured to physically contact the cleaning device to a substrate on the second chuck.

15. The tool of claim 14 , wherein the de-bonding module and the cleaning module are part of a same module, the first chuck and the second chuck being a same chuck.

16. The tool of claim 14 , wherein the de-bonding module and the cleaning module are separate modules.

17. The tool of claim 14 further comprising a transfer tool configured to transfer a substrate between modules.

18. The tool of claim 14 , wherein the spray nozzle is on the second robot arm.

19. The tool of claim 14 , wherein the cleaning module comprises a motor configured to rotate the second chuck.

20. The tool of claim 14 , wherein the cleaning module further comprises a clamp extending over the cover ring configured to secure the cover ring during processing.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Shih Ying-Ching
• Lin Jing-Cheng
• Lu Szu Wei

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P70/70

  Cleaning only by lasers processes, e.g. laser ablation · CPC title

• H10P70/40

  Cleaning for reclaiming · CPC title

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title