High-aspect-ratio vertical interconnects for high-frequency applications
US-2025192077-A1 · Jun 12, 2025 · US
Cleaning only by lasers processes, e.g. laser ablation
Cleaning only by lasers processes, e.g. laser ablation · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P70/70 |
| Official title | {Cleaning only by lasers processes, e.g. laser ablation} |
| Display label | Cleaning only by lasers processes, e.g. laser ablation |
| Total patents | 51 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 2 |
| 2017 | 7 |
| 2018 | 4 |
| 2019 | 6 |
| 2020 | 6 |
| 2021 | 8 |
| 2022 | 2 |
| 2023 | 6 |
| 2024 | 5 |
| 2025 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Substrate processing system and substrate processing method
US-2025191905-A1 · Jun 12, 2025 · US
Film removing method, substrate treating method, and substrate treating apparatus
US-12290876-B2 · May 6, 2025 · US
Substrate processing system and substrate processing method
US-12255063-B2 · Mar 18, 2025 · US
Processing method and processing system
US-2024404852-A1 · Dec 5, 2024 · US
Apparatus for cleaning a semiconductor fabrication chamber
US-2024379345-A1 · Nov 14, 2024 · US
Method and apparatus for treating substrate
US-11972939-B2 · Apr 30, 2024 · US
No-lead integrated circuit having an ablated mold compound and extruded contacts
US-2024105557-A1 · Mar 28, 2024 · US
Apparatus and system for treating substrate
US-11869763-B2 · Jan 9, 2024 · US
Defect removal device, defect removal method, pattern forming method, and method of manufacturing electronic device
US-2023395366-A1 · Dec 7, 2023 · US
Film removing method, substrate treating method, and substrate treating apparatus
US-2023330768-A1 · Oct 19, 2023 · US
Dry cleaning apparatus and dry cleaning method
US-11742221-B2 · Aug 29, 2023 · US
Dry-type cleansing apparatus for wafers
US-2023207304-A1 · Jun 29, 2023 · US
Sequences and equipment for direct bonding
US-2023067677-A1 · Mar 2, 2023 · US
Method of fabricating a display apparatus
US-11569087-B2 · Jan 31, 2023 · US
Dual side de-bonding in component carriers using photoablation
US-11462432-B2 · Oct 4, 2022 · US
Method of manufacturing a silicon carbide device and wafer composite including laser modified zones in a handle substrate
US-11373863-B2 · Jun 28, 2022 · US
Dry cleaning apparatus and dry cleaning method
US-2021343552-A1 · Nov 4, 2021 · US
Substrate processing system and substrate processing method
US-2021296119-A1 · Sep 23, 2021 · US
Display apparatus and a method of fabricating the same
US-2021249616-A1 · Aug 12, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P70/70?
- CPC H10P70/70 is the Cooperative Patent Classification code for “Cleaning only by lasers processes, e.g. laser ablation.”
- How many patents are filed under CPC H10P70/70 (Cleaning only by lasers processes, e.g. laser ablation)?
- Our database includes 51 publications tagged with this CPC code.
- Is patent activity under CPC H10P70/70 growing?
- Publication counts under this code: 5 in 2024 vs 4 in 2025 (latest complete years).