Epitaxial alkali halide layers for iii-v substrate recycling
US-2023197436-A1 · Jun 22, 2023 · US
Cleaning for reclaiming
Cleaning for reclaiming · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P70/40 |
| Official title | {Cleaning for reclaiming} |
| Display label | Cleaning for reclaiming |
| Total patents | 79 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 5 |
| 2016 | 7 |
| 2017 | 7 |
| 2018 | 7 |
| 2019 | 4 |
| 2020 | 14 |
| 2021 | 6 |
| 2022 | 6 |
| 2023 | 12 |
| 2024 | 2 |
| 2025 | 5 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Processing method of device wafer
US-11646229-B2 · May 9, 2023 · US
Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and stripping composition
US-2023125907-A1 · Apr 27, 2023 · US
Composition, and method for cleaning adhesive polymer
US-2023039366-A1 · Feb 9, 2023 · US
Substrate processing method and substrate processing apparatus
US-2022392780-A1 · Dec 8, 2022 · US
Metrology method in wafer transportation
US-11387123-B2 · Jul 12, 2022 · US
Cleaning solution for temporary adhesive for substrates, substrate cleaning method, and cleaning method for support or substrate
US-2022195352-A1 · Jun 23, 2022 · US
Substrate processing system and substrate processing method
US-2022139699-A1 · May 5, 2022 · US
Composition for forming a coating film for removing foreign matters
US-11319514-B2 · May 3, 2022 · US
Decomposing/cleaning composition, method for cleaning adhesive polymer, and method for producing device wafer
US-2022119739-A1 · Apr 21, 2022 · US
Device modified substrate article and methods for making
US-11192340-B2 · Dec 7, 2021 · US
Substrate liquid processing apparatus, substrate liquid processing method and storage medium
US-11189505-B2 · Nov 30, 2021 · US
Composition, method for cleaning adhesive polymer, method for producing device wafer, and method for regenerating support wafer
US-2021317390-A1 · Oct 14, 2021 · US
Processing method of device wafer
US-2021265211-A1 · Aug 26, 2021 · US
Fully automated wafer debonding system and method thereof
US-2021242043-A1 · Aug 5, 2021 · US
Substrate processing apparatus, substrate processing method, and storage medium
US-10998186-B2 · May 4, 2021 · US
Method for manufacturing restored substrate and method for manufacturing light emitting element
US-10763100-B2 · Sep 1, 2020 · US
Substrate liquid processing apparatus, substrate liquid processing method and storage medium
US-2020266079-A1 · Aug 20, 2020 · US
Metrology method in wafer transportation
US-2020251365-A1 · Aug 6, 2020 · US
Substrate processing method and substrate processing apparatus
US-2020194281-A1 · Jun 18, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P70/40?
- CPC H10P70/40 is the Cooperative Patent Classification code for “Cleaning for reclaiming.”
- How many patents are filed under CPC H10P70/40 (Cleaning for reclaiming)?
- Our database includes 79 publications tagged with this CPC code.
- Is patent activity under CPC H10P70/40 growing?
- Publication counts under this code: 2 in 2024 vs 5 in 2025 (latest complete years).