Copper foil provided with carrier foil, manufacturing method of the copper foil provided with carrier foil, and copper clad laminate for laser drilling manufactured by using the copper foil provided with carrier foil

Patent metadata

Field	Value
Publication number	US-10212814-B2
Application number	US-201314381367-A
Country	US
Kind code	B2
Filing date	Feb 27, 2013
Priority date	Mar 1, 2012
Publication date	Feb 19, 2019
Grant date	Feb 19, 2019

Abstract

An object of the present invention is to improve the laser drilling performance of a copper clad laminate whose black-oxide treated surface is used as a laser drilled surface. To achieve the object, a copper foil provided with a carrier foil 1 comprising a layer structure of the carrier foil 2/the releasing layer 3/the bulk copper layer 4 characterized in that metal element-containing particles 5 are disposed between the releasing layer 3 and the bulk copper layer 4 is employed. If the present copper foil provided with a carrier foil is used, a black-oxide treated layer having a color tone excellent in the laser drilling performance can be formed on the surface of the bulk copper layer in the copper clad laminate manufactured.

First claim

The invention claimed is:

1. A copper foil laminate comprising a layer structure of
a carrier foil/
a releasing layer/
a bulk copper layer,
wherein metal element-containing particles are dispersively disposed between the releasing layer and the bulk copper layer;
wherein when the carrier foil is released from the surface of the copper foil laminate, the releasing layer is removed, and metal element-containing particles are exposed on the surface of the bulk copper layer; and
wherein the metal element-containing particles are disposed to make a coverage factor (A) in a visual field of 5 μm×4 μm that meets the relationship
[0% by area]< A≤[ 34% by area].

2. The copper foil laminate according to claim 1 , wherein the metal element-containing particles contain one or more of elements selected from nickel, cobalt, molybdenum, tin and chromium.

3. The copper foil laminate according to claim 1 , wherein the metal element-containing particles are disposed to make an amount transferred on a surface of the bulk copper layer after releasing carrier foil (F) 0 mg/m 2 <F≤100 mg/m 2 .

4. The copper foil laminate according to claim 1 , wherein a particle diameter of the metal element-containing particles is 1 nano-meter to 250 nano-meters.

5. The copper foil laminate according to claim 1 , wherein the bulk copper layer is an electro-deposited copper foil layer formed by an electro-deposition method.

6. A manufacturing method of the copper foil laminate according to claim 1 comprising:
1: formation of a releasing layer on at least one surface of the carrier foil to prepare a carrier foil provided with the releasing layer;
2: cathode polarizing of the carrier foil provided with the releasing layer in a metal element-containing electrolytic solution to dispersively deposit metal element-containing particles on a surface of the releasing layer to prepare a carrier foil provided with the dispersed metal element-containing particles and the releasing layer; and
3: cathode polarizing of the carrier foil provided with the dispersed metal element-containing particles and the releasing layer in a copper electrolytic solution to form a bulk copper layer on the surfaces of the dispersed metal element-containing particles and the releasing layer to finish the copper foil provided with a carrier foil.

7. A copper clad laminate for laser drilling manufactured by using the copper foil laminate according to claim 1 , wherein
the carrier foil is released from the surface of the copper clad laminate provided with the copper foil provided with a carrier foil at an outer layer,
a black-oxide treatment is subjected on the bulk copper layer exposing the metal element-containing particles on the surface, and
the black-oxide treated surface is used as a laser drilled surface.

8. The copper clad laminate for laser drilling according to claim 7 , wherein a value a* and a value b* in an L*a*b* color space at the laser drilled surface satisfy the relationship: [the value a*]≥[the value b*].

9. The copper clad laminate for laser drilling according to claim 7 , wherein a value a* in an L*a*b* color space at the laser drilled surface is 4.5 or less.

Assignees

• Mitsui Mining & Smelting Co

Inventors

• Yoshikawa Kazuhiro

Classifications

• H05K3/025

  by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper · CPC title

• B23K2103/12

  Copper or alloys thereof · CPC title

• B32B2307/538

  Roughness · CPC title

• B23K26/40

  taking account of the properties of the material involved · CPC title

• C25D7/0614

  Strips or foils · CPC title