Passively controlled smart microjet cooling array

Patent metadata

Field	Value
Publication number	US-9247672-B2
Application number	US-201414159016-A
Country	US
Kind code	B2
Filing date	Jan 20, 2014
Priority date	Jan 21, 2013
Publication date	Jan 26, 2016
Grant date	Jan 26, 2016

Abstract

An impingement cooling system for cooling electronic components includes a nozzle array having a plurality of nozzles in fluid communication with a source of cooling fluid, each nozzle including a deflection structure that deforms above a threshold temperature. A plurality of thermally conductive pins respectively are in thermal contact with the deflection structures and conduct heat from at least one of the electronic components to the deflection structures. When a heated nozzle within the nozzle array reaches a temperature above the threshold temperature due to heat conducted from the respective thermally conductive pin, the deflection structure of the heated nozzle deforms from a closed position to an open position to permit cooling fluid to impinge upon the electronic component. The deflection structure may be a deflection plate formed of a bimetallic material having layers of different thermal expansion coefficients, or a thermally responsive two-way shape memory material.

First claim

What is claimed is:

1. An impingement cooling system for cooling electronic components, the impingement cooling system comprising:
a nozzle array including a plurality of nozzles that are in fluid communication with a source of cooling fluid, each nozzle comprising at least one deflection structure that deforms above a threshold temperature; and
a plurality of thermally conductive pins respectively in thermal contact with the deflection structures of the plurality of nozzles that conduct heat from at least one of the electronic components to the deflection structures of the nozzles;
wherein when a heated nozzle within the nozzle array reaches a temperature above the threshold temperature due to heat conducted from the respective thermally conductive pin to the deflection structure of the heated nozzle, the deflection structure of the heated nozzle deforms from a closed position to an open position to permit cooling fluid to impinge upon the at least one of the electronic components.

2. The impingement cooling system of claim 1 , wherein the deflection structure comprises at least one deflection plate/component that deforms above the threshold temperature.

3. The impingement cooling system of claim 2 , wherein the deflection plate/component is in thermal contact with at least one thermally conductive pin.

4. The impingement cooling system of claim 1 , further comprising a nozzle cover plate having a plurality of openings through which cooling fluid may flow when the deflection structures deform from the closed position to the open position.

5. The impingement cooling system of claim 1 , wherein the thermally conductive pins each comprises an inner thermally conductive material surrounded by a thermally insulating layer.

6. The impingement cooling system of claim 1 , further comprising an injector plate, the injector plate comprising:
the nozzle array; and
an inner plate spaced apart from the nozzle array and that retains the thermally conductive pins, wherein the thermally conductive pins are moveable relative to the inner plate to adjust to heights of respective electronic components in thermal contact with the thermally conductive pins during the installation process.

7. The impingement cooling system of claim 1 , further comprising an injector plate, the injector plate comprising:
a nozzle array; and
an inner plate co-planar with the nozzle array and that retains the thermally conductive pins, wherein the thermally conductive pins are moveable relative to the inner plate to adjust to heights of respective electronic components in thermal contact with the thermally conductive pins during the installation process.

8. The impingement cooling system of claim 1 , further comprising a thermally conductive layer that conducts heats from the electronic components to the thermally conductive pins.

9. The impingement cooling system of claim 8 , wherein the thermally conductive layer is impermeable to the cooling fluid.

10. The impingement cooling system of claim 1 , further comprising a cover plate, wherein the nozzle array and the cover plate define a fluid flow path that provides an inlet for the cooling fluid to flow to the nozzles of the nozzle array.

11. The impingement cooling system of claim 1 , whereby the conductive pins terminate at the nozzle cover plate and do not protrude into the inlet flow path.

12. The impingement cooling system of claim 1 , wherein at least part of the deflection structures are formed of a bimetallic material comprising a first metallic layer having a first thermal expansion coefficient, and a second metallic layer having a second thermal expansion coefficient that is different from the first thermal expansion coefficient.

13. The impingement cooling system of claim 1 , wherein the deflection structures are formed of a shape memory metal alloy or shape memory polymer which is temperature responsive.

14. The impingement cooling system of claim 1 , wherein when a heated nozzle within the nozzle array cools to a temperature below the threshold temperature, the deflection structure of the heated nozzle returns to the closed position.

15. An impingement cooling system for cooling electronic components, the impingement cooling system comprising:
a nozzle array including a plurality of nozzles that are in fluid communication with a source of cooling fluid, each nozzle comprising a deflection structure that deforms above a threshold temperature, and an extension plate connected to the deflection structure that moves when the deflection structure deforms; and
a plurality of thermally conductive pins respectively in thermal contact with the deflection structures of the plurality of nozzles that conduct heat from at least one of the electronic components to the deflection structures of the nozzles;
wherein when a heated nozzle within the nozzle array reaches a temperature above the threshold temperature due to heat conducted from the respective thermally conductive pin to the deflection structure of the heated nozzle, the deflection structure of the heated nozzle deforms to move the extension plate of the heated nozzle from a closed position to an open position to permit cooling fluid to impinge upon the at least one of the electronic components.

16. The impingement cooling system of claim 15 , wherein the deflection structure comprises a spiral deflection element of a shape memory alloy or polymer material, or bimetallic strip.

17. The impingement cooling system of claim 16 , wherein the spiral deflection element of the heated nozzle deforms above the threshold temperature about a center axis to rotate the extension plate of the heated nozzle from the closed position to the open position.

18. The impingement system of claim 15 , further comprising a control plate adjacent the nozzle array and including a plurality of openings adjacent the nozzles, wherein when the extension plate of the heated nozzle moves from the closed position to the open position, cooling fluid is permitted to pass through at least one of the openings of the control plate to impinge upon the respective electronic component.

19. The impingement system of claim 18 , wherein the control plate adjacent to the nozzle is made of thermally insulating material.

20. An electronics component system comprising:
a circuit board having at least one electronic component mounted thereon; and
an impingement cooling system;
wherein the impingement cooling system comprises:
a nozzle array including a plurality of nozzles that are in fluid communication with a source of cooling fluid, each nozzle comprising at least one deflection structure that deforms above a threshold temperature; and
a plurality of thermally conductive pins respectively in thermal contact with the deflection structures of the plurality of nozzles that conduct heat from at least one of the electronic components to the deflection structures of the nozzles;
wherein when a heated nozzle within the nozzle array reaches a temperature above the threshold temperature due to heat conducted from the respective thermally conductive pin to the deflection structure of the heated nozzle, the deflection structure of the heated nozzle deforms from a closed position to an open position to permit cooling fluid to impinge upon the at least one of the electronic components.

21. The electronics component system of claim 20 , wherein the impingement cooling system further comprises an injector plate;
the injector plate comprising:
the nozzle array; and
an inner plat

Assignees

• Parker Hannifin Corp

Inventors

• Mehring Carsten

Classifications

• H05K7/20345

  Sprayers; Atomizers · CPC title

• H05K7/20136

  Forced ventilation, e.g. by fans (H05K7/202 takes precedence) · CPC title

• H05K7/20 Primary

  Modifications to facilitate cooling, ventilating, or heating · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W40/475 Primary

  using jet impingement (H10W40/776 takes precedence) · CPC title